WMSIC Electronic Components

LGE SD10U100SL

ModelSD10U100SL
PackageTO-277
BrandLGE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LGE SD10U100SL
Type
LGE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LGE
Electronic Component
SD10U100SL
Electronic Component
1
Package
TO-277
Electronic Component
Schottky Diode
Electronic Component
0.11g
Electronic Component
1
Electronic Component
BM0228289871
Current
10A
Diode
Electronic Component
Current(Ir)
200uA@100V
(Vf)
570mV@10A
Electronic Component
Electronic Component
Electronic Component
5000
Voltage Rating(Vr)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SD10U100SL 产品概述

一、产品简介

SD10U100SL 是 LGE(鲁光)出品的一款独立式肖特基整流二极管,采用 TO-277 封装,面向中高功率整流与保护应用。该器件在大电流工作点下保持较低正向压降并具备较高的反向耐压与低反向漏电特性,适合开关电源、DC-DC 转换器、逆变器及整流桥等场景。

二、主要性能参数

  • 型号:SD10U100SL;品牌:LGE(鲁光)
  • 二极管配置:独立式(单只肖特基二极管)
  • 正向压降:Vf = 570 mV @ IF = 10 A
  • 额定整流电流:IF(AV) = 10 A
  • 直流反向耐压:VR = 100 V
  • 反向漏电流:IR = 200 μA @ VR = 100 V
  • 非重复峰值浪涌电流:Ifsm = 200 A(厂商给定,具体浪涌波形/持续时间请参见原厂资料)
  • 封装:TO-277(便于散热和机械安装)

三、产品特点

  • 低正向压降:在 10 A 工作点 Vf 仅约 0.57 V,可降低整流损耗,提高系统效率。
  • 低反向漏电:100 V 下 IR 约 200 μA,适用于对漏电敏感的电源设计。
  • 强抗浪涌能力:Ifsm 高达 200 A,能承受启动或短时故障带来的冲击电流(注意按数据表确认浪涌条件)。
  • 快速响应:作为肖特基二极管,开关损耗和恢复时间均优于普通整流二极管,适合高频整流场合。
  • 工业封装:TO-277 便于与散热片直接接触或螺栓固定,利于热流散。

四、典型应用场景

  • 开关电源(SMPS)次级整流与同步降压旁路保护
  • DC-DC 转换器输出整流
  • 电池充放电路径、逆变器与太阳能逆变系统的保护元件
  • 电机驱动与电力电子模块中的自由轮或回流整流
  • 逆向极性保护与高频整流场合

五、使用建议与热管理

  • 散热设计:在 10 A 等高电流工作时,即便 Vf 较低也会产生显著功耗(P = Vf × I),建议使用适当散热片或背板导热以保证结温控制在安全范围内。TO-277 封装有利于热传导,请确保良好机械与热接触。
  • 浪涌保护:Ifsm 支持短时浪涌但不等于可长期承受,请结合系统可能的浪涌波形(如 8/20 μs 或 10 ms)进行匹配与评估,必要时并联浪涌抑制器或选择更高规格器件。
  • 温度与漏电:肖特基二极管漏电随温度上升明显增加,若工作环境温度高于常温需注意反向漏电对系统的影响并适当降额。
  • 焊接与可靠性:遵循制程中关于 TO-277 的焊接温度与时间限制,避免长时间高温导致封装或钎焊界面应力。

六、封装与选型注意

TO-277 封装适合需要机械固定和高效散热的场合;在板级密集布局或需表面贴装的设计中可能不适用。选型时除电气参数外,应对照原厂完整数据表确认最大结温、热阻、脉冲浪涌条件及典型特性曲线,以确保长期可靠性。

如需替代或匹配方案,可根据 Vf、VR、IF 和 Ifsm 等关键指标比对同类肖特基型号,或联系供应商获取样片与完整数据手册以完成最终验证。

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