WMSIC Electronic Components

LGE LLDB3

ModelLLDB3
PackageMINIMELF
BrandLGE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LGE LLDB3
Type
LGE
Minimum package
2500

Technical parameters

Electronic Component
LGE
Electronic Component
LLDB3
Electronic Component
1
Package
MINIMELF
Electronic Component
Diode
Electronic Component
0.05g
Electronic Component
1
Electronic Component
BM0265872163
Current(Ir)
10uA
(tr)
2us
Output Voltage(Vo)
5V
Current(It)
2A
Current(Ibo)
50uA
Dynamic Voltage
5V
Electronic Component
40℃~+125℃
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LLDB3触发二极管产品概述

LLDB3是LGE(鲁光) 推出的一款MiniMELF封装触发二极管,专为需要快速响应、宽温适应的过压保护及触发控制场景设计。产品整合了低触发电流、高通态能力与紧凑封装等优势,可满足工业控制、汽车电子、通信设备等领域的多样化需求。

一、产品定位与核心优势

LLDB3定位于中小功率触发/保护场景,核心优势体现在:

  1. 高集成度封装:采用MiniMELF小型金属封装,体积紧凑(行业标准尺寸约φ2.0×5.2mm),适配高密度PCB设计;
  2. 宽温可靠:工作结温覆盖-40℃~+125℃,符合工业级环境要求,可稳定工作于极端温度场景;
  3. 快速响应:上升时间仅2μs,能在过压事件发生时毫秒级导通,有效保护后端器件;
  4. 低触发门槛:转折电流仅50μA,无需大功率驱动电路即可触发,降低系统设计复杂度;
  5. 参数一致性:转折电压对称性≤3V,双向触发时电压差小,确保电路性能稳定。

二、关键电气参数详解

LLDB3的核心参数经过优化,兼顾触发灵敏度与通态可靠性:

参数项 典型值/范围 说明 转折电压(Vbo) 典型32V;28V~36V 器件导通的临界电压范围 转折电流(Ibo) 50μA 触发导通所需最小电流 通态电流(It) 2A 持续导通时的最大允许电流 上升时间(tr) 2μs 从截止到导通的响应速度 动态转折电压 5V 脉冲电压下的导通临界值 漏电流(Ir) 10μA 截止态时的反向漏电流 输出电压(Vo) 5V 导通后稳定输出电压 转折电压对称性 3V 双向触发时正负电压差

注:参数为典型工作条件下的规格,具体需参考产品 datasheet。

三、封装与可靠性设计

LLDB3采用MiniMELF金属封装,具备以下可靠性优势:

  1. 抗环境能力强:金属外壳密封,可抵抗湿度、灰尘侵蚀,同时抗振动(10G以上)、抗冲击(100G以上),适合车载、工业设备等振动场景;
  2. 散热效率高:金属封装的热传导性优于塑料封装,可快速散发布尔热效应产生的热量,延长器件寿命;
  3. 焊接兼容性:引脚采用可焊性良好的材料,适配回流焊、波峰焊等标准焊接工艺,降低生产不良率。

四、典型应用场景

LLDB3的参数特性使其广泛应用于以下场景:

  1. 过压保护电路:用于电源模块、通信接口(如RS485、CAN总线)的过压防护,当电压超过28V~36V范围时快速导通,泄放浪涌电流,保护MCU、传感器等敏感器件;
  2. 晶闸管(SCR)/IGBT触发:作为触发管驱动SCR或IGBT,低触发电流(50μA)可直接由MCU GPIO驱动,无需额外放大电路;
  3. 汽车电子系统:适配车载环境(-40℃~+125℃),用于车灯控制、传感器接口的过压保护,满足汽车级可靠性要求;
  4. 脉冲生成电路:在定时器、振荡器中作为脉冲触发元件,稳定的转折电压(28V~36V)保证脉冲频率/幅度一致性;
  5. 工业控制设备:用于PLC输入输出接口、电机驱动电路的保护,适应工业现场的温度波动与电磁干扰。

五、选型与使用注意事项

为确保LLDB3的稳定工作,需注意以下要点:

  1. 电压匹配:根据系统正常工作电压选择型号,确保工作电压低于转折电压下限(28V),避免误触发;
  2. 限流保护:通态电流最大2A,需串联10Ω~100Ω限流电阻(根据应用功率调整),防止过流损坏;
  3. 温度管理:安装时避免靠近高热元件,确保结温不超过125℃;
  4. 封装焊接:MiniMELF封装为圆柱型,焊接时需注意引脚间距(通常为5mm),焊接温度控制在260℃以下(持续时间≤3s);
  5. 双向应用:若需双向过压保护,可利用转折电压对称性(≤3V),无需额外匹配器件,简化电路设计。

LLDB3凭借紧凑封装、宽温可靠与快速响应等特性,成为工业控制、汽车电子等领域中小功率触发/保护的优选器件。如需详细参数或应用方案,可参考LGE官方 datasheet或联系技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.