WMSIC Electronic Components

Leiditech PESDMC2FD5VB

ModelPESDMC2FD5VB
PackageDFN1006-2
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech PESDMC2FD5VB
Type
LEIDITECH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
PESDMC2FD5VB
Electronic Component
1
Package
DFN1006-2
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.017g
Electronic Component
1
Cj- Capacitor
0.22pF
Electronic Component
BM0257609345
Voltage
23V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA
Voltage(VBR)
6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

P E S D M C 2 F D 5 V B 产品概述

一、产品简介

PESDMC2FD5VB 是 Leiditech(雷卯电子)推出的一款面向高速接口和敏感芯片引脚的瞬态抑制器(ESD保护器件)。器件工作电压 Vrwm 为 5V,击穿电压(Vbr)约 6V,典型钳位电压可达 23V,能在 8/20µs 波形下承受峰值脉冲功率 110W。器件反向漏电流低至 500nA,结电容仅 0.22pF,封装为小型 DFN1006-2,适合对占板面积和信号完整性有严格要求的应用场合。

二、关键电气参数(要点)

  • 反向截止电压(Vrwm):5V,适配 5V 工作电平系统
  • 击穿电压(Vbr):6V(典型)
  • 钳位电压:23V(典型)
  • 峰值脉冲功率(Ppp):110W @ 8/20µs
  • 反向电流(Ir):500nA(典型)
  • 结电容(Cj):0.22pF,利于高速信号线的低失真保护
  • 防护等级:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)与 IEC 61000-4-5(浪涌)标准

三、主要特点与优势

  • 低电容(0.22pF):对高速接口(USB、LVDS、SATA、HDMI、高清视频链路等)几乎无影响,保持信号完整性。
  • 高能量吸收:110W/8/20µs 的脉冲能力能够钳制来自人体放电和浪涌的瞬态能量,保护下游芯片。
  • 低漏电:500nA 的低反向电流有利于节省静态功耗,适用于电池供电设备。
  • 小型封装 DFN1006-2:节省 PCB 空间,适合手机、可穿戴、消费类电子与便携式设备。
  • 通过工业级 EMC 标准认证,适用于严苛电磁兼容环境。

四、典型应用场景

  • USB、音频/视频高速差分信号线的ESD与浪涌保护
  • 手机、平板、笔记本等便携终端的外部接口保护
  • 物联网设备和传感器模块中的微弱信号输入保护
  • 工业控制与通信模块的接口防护(需结合系统浪涌等级确认)

五、使用建议与布局要点

  • 位置:将器件尽量靠近外部连接器或 PCB 边缘,缩短被保护线到器件的距离以提高防护效果。
  • 接地:GND 引脚应有低阻抗回流路径,尽量使用单点或短回流面的安排,避免长回流走线。
  • 串联元件:在需额外抑制的场合可与系列电阻、共模电感或滤波器结合使用,以分担能量并改善整体 EMC 性能。
  • 热与焊接:DFN 小封装在回流焊时注意工艺参数,保持焊点质量以确保长期可靠性。
  • 极性确认:在使用前请确认具体器件是单向还是双向型号(PESDMC2 系列可能有不同变型),按数据手册接线。

六、选型与可靠性注意

选择时应确认 Vrwm 与系统工作电压匹配,钳位电压需低于被保护器件的耐压门槛;结电容越低越适合高速信号。器件已符合 IEC 多项防护标准,但实际产品认证要求(如车规级)需参考完整规格书与认证文件。DFN1006-2 封装便于高密度布局,但对焊接可制造性有一定要求,量产前建议进行焊接与热循环可靠性验证。

品牌:Leiditech(雷卯电子)
封装:DFN1006-2
型号:PESDMC2FD5VB

如需更详细的电气特性曲线、典型钳位与能量测试数据、参考电路或 PCB 参考布局图,请提供具体应用场景或索取完整数据手册。

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