WMSIC Electronic Components

Leiditech ESD112-B1-02EL

ModelESD112-B1-02EL
PackageDFN1006-2
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech ESD112-B1-02EL
Type
LEIDITECH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
ESD112-B1-02EL
Electronic Component
1
Package
DFN1006-2
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.013g
Electronic Component
1
Cj- Capacitor
0.22pF
Electronic Component
BM0209247880
Voltage
23V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA
Voltage(VBR)
6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD112-B1-02EL 静电与浪涌保护器件产品概述

一、产品基本信息

ESD112-B1-02EL是雷卯电子(Leiditech)推出的静电放电(ESD)与瞬态电压抑制(TVS)复合保护器件,专为电子设备的过压防护设计。该器件采用DFN1006超小型封装(尺寸1.0mm×0.6mm),无引脚设计,可适配高密度PCB布局,满足小型化电子终端的空间需求。

二、关键电气参数及特性

  1. 低结电容适配高速信号:结电容(Cj)仅0.22pF,远低于常规ESD器件,可最大程度减少对高频/高速信号(如USB 3.0、HDMI、蓝牙射频信号)的传输损耗,保证信号完整性,避免信号失真。
  2. 电压匹配与快速响应:反向截止电压(Vrwm)为5V,精准匹配3.3V/5V主流供电系统,正常工作时无泄漏;击穿电压(Vbr)6V,确保静电/浪涌冲击时快速导通(响应时间<1ns),及时钳位过压。
  3. 过压防护能力:钳位电压(Vc)23V,可将瞬态过压限制在后端敏感元器件的安全耐受范围内;峰值脉冲功率(Ppp)达110W(@8/20μs浪涌波形),能承受多次静电放电及中等强度浪涌冲击。
  4. 低功耗设计:反向电流(Ir)仅500nA(@Vrwm=5V),静态功耗极低,不影响系统待机电流与正常工作效率,适配低功耗电子设备。

三、防护性能与标准认证

该器件通过IEC 61000-4系列核心防护标准,覆盖电子设备常见的电磁干扰场景:

  • IEC 61000-4-2(静电放电):支持接触放电±8kV、空气放电±15kV等级,有效防护人体静电、设备间静电转移及静电感应干扰;
  • IEC 61000-4-4(电快速瞬变脉冲群EFT):抑制开关瞬态、电机干扰等快速脉冲群,避免设备误触发、数据丢失;
  • IEC 61000-4-5(浪涌):应对电源/信号线上的浪涌冲击(如雷击感应、电网瞬变),保护后端IC、传感器等敏感元件。

四、适用应用场景

由于低结电容、小封装及宽防护范围,ESD112-B1-02EL广泛适用于:

  • 便携式电子设备:智能手机、平板电脑、智能手表/手环、便携式蓝牙音箱;
  • 高速接口防护:USB 2.0/3.0接口、HDMI接口、Type-C接口、音频接口;
  • 无线通信模块:蓝牙、WiFi、NFC、4G/5G射频模块;
  • 物联网终端:智能家居节点、可穿戴传感器、工业物联网终端、智能家电控制模块。

五、封装与可靠性说明

DFN1006封装采用无引脚设计,散热性能优异,且占位面积仅0.6mm²,适合高密度PCB布局;器件采用工业级工艺制造,可承受≥1000次静电放电冲击,多次瞬态冲击后性能稳定,适配消费电子及部分工业应用场景的可靠性要求。

该器件兼具ESD快速响应与TVS浪涌防护能力,是小型化电子设备过压防护的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.