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Leiditech LXES15AAA1-133
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Leiditech LXES15AAA1-133
- Type
- LEIDITECH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LEIDITECH
- Electronic Component
- LXES15AAA1-133
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.05pF
- Electronic Component
- BM0229921449
- Operating Temperature
- 55℃~+125℃
- Voltage
- 40V
- Electronic Component
- IEC 61000-4-2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LXES15AAA1-133 — 产品概述
一、产品简介
LXES15AAA1-133 是 Leiditech（雷卯电子）推出的一款单路双向表面贴装 ESD 防护器件，采用 0402 小封装，专为敏感信号线和高频接口提供瞬态静电放电保护。该器件结构紧凑、结电容极低，适合对信号完整性要求高、空间受限的移动设备、通信接口和精密仪器防护场合。
二、主要参数
- 品牌：Leiditech（雷卯电子）
- 型号：LXES15AAA1-133
- 类型：ESD 二极管（双向）
- 通道数：单路
- 钳位电压（V clamping）：40 V
- 反向漏电流 Ir：10 nA（常温）
- 结电容 Cj：0.05 pF（典型，极低）
- 工作温度范围：-55 ℃ ~ +125 ℃
- 防护等级：符合 IEC 61000-4-2 静电放电防护规范
- 封装：0402（SMD）
三、产品特点与优势
- 极低结电容（0.05 pF）：对高速信号线影响极小，适用于 USB、PCIe、HDMI、射频和其他高速差分/单端信号保护。
- 双向钳位：可在正、负极性瞬态下对信号线进行对称保护，无需额外极性判断，适合 AC 或双向差分信号。
- 小封装（0402）：占板面积小，便于在空间受限的移动终端、摄像头模组和可穿戴设备上布局。
- 宽温区与低泄漏：-55~+125 ℃ 的工业级温度适配，10 nA 低反向电流有利于微弱信号应用，减少偏置误差。
四、典型应用场景
- 智能手机、平板及可穿戴设备的 I/O 接口防护；
- 高速数据接口（USB、HDMI、LVDS、MIPI、差分对）信号保护；
- 摄像头模组、传感器和射频前端附近的静电保护；
- 工业控制器和仪表的输入/输出防护。
五、PCB 布局与使用建议
- 尽量将器件放置在被保护的连接器或信号输入端口的附近，缩短到地/电源的回流路径。
- 对高速差分信号，若为双线差分传输，通常每条线需配备一个单路 ESD 器件；保持对称布局以避免插入不平衡。
- 放置接地焊盘与回流路径要尽量短而粗，避免通过长走线回到系统地，减小回路电感，提高钳位效率。
- 0402 封装对贴装工艺及回流温度曲线敏感，遵循常规无铅回流工艺及厂方焊接建议以保证可靠焊点。
六、可靠性与合规性
LXES15AAA1-133 设计用于满足 IEC 61000-4-2 等静电放电测试要求，在典型的 ESD 冲击场合能提供稳定的钳位保护。器件的工业级温度范围及低漏电特性，适合长期在严苛环境下工作。建议在产品设计阶段进行系统级 ESD 测试验证，以确保整体防护性能满足最终应用标准。
七、封装与采购信息
- 封装：0402 SMD，适合自动贴装生产；
- 建议在采购与备货时关注包装卷带、最低订购量与交期；如需样品评估，可向雷卯电子或其分销商咨询样片及技术支持。
如需进一步的电气特性曲线、封装尺寸图或参考电路建议图，可提供具体应用场景与测试条件，我可以根据需求给出更详细的设计建议。
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