WMSIC Electronic Components

Leiditech SP0402B-ULC-01ETG

ModelSP0402B-ULC-01ETG
PackageDFN1006
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech SP0402B-ULC-01ETG
Type
LEIDITECH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
SP0402B-ULC-01ETG
Electronic Component
1
Package
DFN1006
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
0.22pF
Electronic Component
BM0265086922
Voltage
23V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA
Voltage(VBR)
6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP0402B-ULC-01ETG ESD防护器件产品概述

雷卯电子(Leiditech)推出的SP0402B-ULC-01ETG是一款针对敏感电子电路设计的ESD/瞬态浪涌防护专用器件,聚焦高速信号完整性与高密度布局需求,兼顾多标准电磁兼容(EMC)防护能力,广泛适配消费电子、IoT终端、射频通信等领域的轻小型化产品设计。

一、核心防护参数的应用价值解析

器件的防护性能需结合参数阈值与实际电路需求理解,关键参数如下:

1. 防护阈值与导通特性

  • 反向截止电压(Vrwm=5V):电路正常工作时,器件反向偏置下可稳定承受5V电压,无导通漏电流,确保3.3V/5V主流供电电路的正常运行;
  • 击穿电压(Vbr=6V):当瞬态干扰电压超过6V时,器件快速导通(响应时间达ps级),避免后端芯片(如MCU、射频IC)因过压损坏;
  • 钳位电压(Vc=23V):导通后将干扰电压钳位至23V以下,远低于多数半导体器件的IO口击穿阈值(≥30V),实现有效过压保护。

2. 脉冲能量耐受能力

  • 峰值脉冲功率(Ppp=110W@8/20μs):8/20μs为IEC 61000-4-5标准浪涌电流波形(峰值时间8μs、半峰值时间20μs),110W功率容量可承受常见开关浪涌、轻微雷电浪涌(如1kV/2Ω浪涌),覆盖日常应用场景的能量冲击。

3. 低干扰与低功耗特性

  • 反向漏电流(Ir=500nA):正常工作时漏电流仅500纳安,几乎不增加电路功耗,适配IoT终端等低功耗设备;
  • 结电容(Cj=0.22pF):寄生电容低至0.22pF,并联在高速信号线上时,不会对10Gbps以上的高速数据传输造成明显信号衰减(如USB 3.1、HDMI 2.0),保障信号完整性。

二、国际EMC标准的全面覆盖

器件通过三项核心IEC电磁兼容标准验证,适配不同场景的瞬态干扰防护:

1. IEC 61000-4-2(ESD防护)

支持人体静电放电(接触放电8kV、空气放电15kV),可有效泄放日常操作中的静电能量(如用户触摸设备接口时的静电),避免芯片被静电击穿。

2. IEC 61000-4-4(EFT防护)

应对电快速瞬变脉冲群(频率100kHz、脉冲宽度ns级),器件的快速响应能力可快速导通泄放干扰,防止后端电路出现误触发或数据错误。

3. IEC 61000-4-5(浪涌防护)

兼容1.2/50μs电压浪涌、8/20μs电流浪涌,可防护电源端或信号端的浪涌干扰(如电网波动、设备开关冲击)。

三、小封装与高密度布局适配

1. DFN1006封装的优势

  • 尺寸紧凑:1.0mm×0.6mm的超小封装,比传统0402封装节省30%以上PCB面积,适配智能手表、蓝牙耳机等轻小型设备的高密度主板布局;
  • 无引脚设计:DFN(无引脚扁平封装)减少寄生电感,提升高频性能,同时散热效率优于传统封装,适合高功率脉冲场景。

2. 多接口并行防护

小封装支持在同一PCB上并联多个器件,覆盖USB、HDMI、SIM卡、射频天线等多接口防护,满足复杂设备的多通道干扰防护需求。

四、品牌可靠性与应用场景

1. 雷卯电子的技术保障

雷卯电子专注电磁防护器件10余年,产品通过ISO 9001质量体系认证,器件经过温度循环(-55℃~125℃)、湿度测试(85℃/85%RH)等可靠性验证,确保工业级应用稳定性。

2. 典型应用场景

  • 高速数字接口:USB 3.0/3.1、HDMI 2.0、以太网(1G/10G)的ESD防护;
  • 射频通信模块:蓝牙5.0、WiFi 6/6E、5G Sub-6G天线端的浪涌/ESD防护;
  • 可穿戴设备:智能手表的充电接口、传感器接口防护;
  • IoT终端:智能家居摄像头、智能音箱的通信接口防护。

五、产品价值总结

SP0402B-ULC-01ETG平衡了低电容(信号完整性)、小封装(高密度布局)、多标准防护(EMC合规) 三大核心需求,是敏感电子电路ESD/浪涌防护的高性价比选择。其稳定的防护性能可有效降低产品售后维修率,提升终端设备的可靠性与市场竞争力。

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