WMSIC Electronic Components

Leiditech SR05-04A

ModelSR05-04A
PackageSOT-26
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech SR05-04A
Type
LEIDITECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
SR05-04A
Electronic Component
1
Package
SOT-26
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.025g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.5pF
Electronic Component
BM0257609340
Operating Temperature
55℃~+125℃
Voltage
28V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SR05-04A 产品概述

SR05-04A 是 Leiditech(雷卯电子)推出的一款四路低容抗静电/浪涌保护器件,采用紧凑的 SOT-26 封装,专为 5V 及以下工作电压的高频信号线和接口保护设计。在满足 IEC 61000-4-2(静电放电,ESD)、IEC 61000-4-4(快速瞬变脉冲,EFT)及 IEC 61000-4-5(浪涌)等工业级抗扰度标准的同时,兼顾低漏电与低结电容特性,适合对体积、速度与可靠性均有较高要求的应用场景。

一、主要电气参数

  • 反向截止电压 (Vrwm):5 V,适合 5V 系统保护
  • 击穿电压:6 V(典型),在 Vrwm 以上进入导通钳位区
  • 钳位电压:28 V(典型),8/20 μs 浪涌下的电压限制能力
  • 峰值脉冲功率 (Ppp):350 W @ 8/20 μs,能承受大幅度瞬态冲击
  • 反向电流 (Ir):1 μA(典型),低漏电,适用于节电与高阻抗电路
  • 结电容 (Cj):0.5 pF/通道(典型),对高速信号影响极小
  • 通道数:4 路,适合多线接口集成保护
  • 工作温度:-55 ℃ ~ +125 ℃,满足工业级温度要求
  • 封装:SOT-26,体积小,适合高密度 PCB 布局

二、特性与优势

  • 低结电容(0.5 pF)保证对高速差分数据(数百 MHz 乃至 GHz 级)影响极小,适合 USB、摄像头、显示接口以及高速串行总线的防护需求。
  • 高峰值脉冲功率与较低钳位电压组合,在遭遇雷击或开关瞬变时能有效钳制电压,保护后级芯片免受过压损坏。
  • 低反向电流减少静态功耗,有利于便携式设备与待机电路的能耗控制。
  • 四路集成与 SOT-26 小封装,节约 PCB 面积,简化布线与 BOM 管理。

三、典型应用

  • USB、USB-C、MIPI、CSI/DSI 摄像头接口保护
  • RJ45、以太网收发器接口的端口级防护(需根据系统电压核对)
  • 手机、平板、笔记本和外设的 I/O 接口保护
  • 工业控制、测量仪器及户外设备的信号线防护
  • 通信设备与高密度连接器处的静电、浪涌防护

四、PCB 布局与使用建议

  • 器件应尽可能靠近被保护的连接器或接口放置,减少受保护路径上的走线长度。
  • 将器件的地引脚短而粗地连接到地平面,采用单点接地或热刺式过孔以提高脉冲能量散逸能力。
  • 对高速差分信号,保持差分线对阻抗连续性,必要时配合串联阻抗或共模扼流圈以改善抗扰度。
  • 对于反复遭受大能量冲击的场合,建议在系统设计中加入过流保护或熔断元件以做二次防护。
  • 在元件选型时,确认器件为单向或双向配置以匹配具体信号类型(差分/单端)。

五、封装与可靠性

  • SOT-26 封装兼顾热散与空间利用,符合常见贴片工艺。
  • 宽工作温度范围 (-55 ℃ ~ +125 ℃) 适合工业级环境,但如需汽车级应用,应核实是否满足 AEC-Q 等级要求。
  • 器件通过 IEC 61000 系列抗扰度标准认证,适合对 ESD/EFT/浪涌有严格要求的产品设计。

六、选型提示

  • 若系统工作电压为 5V 或以下,且对高速信号的影响要求严格(如 USB3.0/HDMI 等),SR05-04A 是优先考虑的器件之一。
  • 若电路容忍较高的钳位电压或需要更高能量吸收,需对比其他高能器件的 Ppp 与 Vcl 参数。
  • 在设计前确认器件的单/双向特性与接口电平,以避免误选造成保护失效或信号畸变。

结论:SR05-04A 以其低电容、低漏电、四路集成与工业级抗扰能力,适合大多数需要在紧凑空间内实现多路高速信号防护的应用,是工程师在信号端口保护设计中的实用选择。如需具体封装引脚图或针对某一接口的参考电路,建议参考 Leiditech 官方数据手册或联系供应商获取更详尽的应用资料。

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