WMSIC Electronic Components

Leiditech SMF5.0CA

ModelSMF5.0CA
PackageSOD-123FL
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech SMF5.0CA
Type
LEIDITECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
SMF5.0CA
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0257609339
Operating Temperature
55℃~+125℃
Voltage
9.2V
Current(Ir)
150uA
Voltage(VBR)
6.4V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF5.0CA 产品概述

SMF5.0CA 是 Leiditech(雷卯电子)提供的一款双向瞬态电压抑制器(TVS),采用 SOD-123FL 小型封装,专为 5V 电源和信号线路的浪涌保护设计。器件在瞬态冲击时能快速钳位过电压,保护下游电子元件免受雷击、电源浪涌和开关瞬变的损害,同时具备低漏电与宽工作温度范围,适用于空间受限且需高可靠防护的应用场景。

一、主要参数概要

  • 极性:双向(Bidirectional)
  • 反向截止电压 Vrwm:5 V
  • 击穿电压 Vbr(标称):6.4 V
  • 钳位电压 Vc(典型):9.2 V(在峰值脉冲电流条件下)
  • 峰值脉冲电流 Ipp:21.7 A(典型,10/1000 µs 波形)
  • 峰值脉冲功率 Ppp:200 W(10/1000 µs 波形)
  • 反向漏电流 Ir:150 µA(在 Vrwm=5 V 条件下)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 封装:SOD-123FL(小体积表面贴装)

二、产品特性

  • 双向保护:适合交流或双向浪涌的保护需求,无需区分极性,安装更灵活。
  • 高脉冲吸收能力:Ppp 200 W 的瞬态能量吸收能力,能承受工业级或雷击类的短时浪涌脉冲(按 10/1000 µs 标准)。
  • 有效钳位:在峰值脉冲电流下钳位电压约 9.2 V,有效限制被保护线路的过压幅度,降低下游器件应力。
  • 低工作电压适配 5V 系统:Vrwm=5 V 专为 5V 电源与数据信号(如 USB、TTL 接口等)设计,兼顾稳态漏电和保护效率。
  • 小尺寸封装:SOD-123FL 有利于高密度电路板布局,易于自动贴装和回流焊接。
  • 宽温度范围:-55 ℃ 至 +125 ℃,适应工业级温度要求。

三、典型应用场景

  • USB、RS-232/RS-485、CAN 等 5V/双向信号接口端口防护
  • 电源输入端口的浪涌保护(5V 供电总线)
  • 工业控制设备、仪器仪表的瞬态抑制
  • 通信设备、物联网终端与消费类电子中对接口的浪涌防护
  • 电池管理与便携设备的输入保护(注意与系统漏电容要求匹配)

四、封装与安装建议

  • 封装:SOD-123FL,体积小,焊盘尺寸适合常规表面贴装工艺。
  • 安装位置:建议将 TVS 尽量靠近受保护的接口或源头(如连接器、线缆入口),以减小串联电感导致的钳位效率下降。
  • 焊接:支持回流焊,遵循制造商推荐的回流曲线以避免热应力损伤。
  • 布局:正负两端走线尽量短且宽,避免长走线引入额外的寄生电感。

五、使用注意事项与可靠性提示

  • 工作环境:尽管器件工作温度范围宽,但长期处于高温或频繁遭受高能冲击会影响寿命,应结合系统冗余与合适的散热管理。
  • 漏电要求:Ir=150 µA(Vrwm=5 V)为典型值,若系统对漏电流敏感(如超低功耗应用),需评估该漏电对待机与休眠态的影响。
  • 多次冲击能力:TVS 在设计上能承受多次小幅脉冲,但对于大能量多次冲击应考虑级联保护或更大能量吸收器件。
  • 选型匹配:在需要更低钳位、更高能量或更低漏电的场合,可对比相邻额定电压的产品或其他封装规格以获得最佳保护效果。

六、典型电路与选型建议

  • 对于 USB 5V 电源线路,可将 SMF5.0CA 直接并联连接于电源与地之间(双向型无需极性区分),在靠近插座或电源输入处放置。
  • 如需同时保护数据线与电源线,建议在每条敏感线上分别放置适当额定值的 TVS,或使用多通道防护阵列。
  • 选型时关注的关键参数:Vrwm 与目标系统工作电压的匹配、Vc 在峰值脉冲下是否低于下游器件耐压、Ipp/Ppp 是否能承受预期浪涌能量、封装热散与 PCB 布局是否支持散热。

若需进一步的器件数据手册、封装尺寸图或样品采购信息,请联系 Leiditech(雷卯电子)或其授权分销商以获取完整性能曲线、浪涌测试条件(例如 10/1000 µs)及可靠性认证资料。

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