WMSIC Electronic Components

Leiditech ESDA33CT

ModelESDA33CT
PackageSOD-523
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech ESDA33CT
Type
LEIDITECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
ESDA33CT
Electronic Component
1
Package
SOD-523
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.022g
Electronic Component
1
Cj- Capacitor
18pF
Electronic Component
BM0229921450
Operating Temperature
55℃~+125℃
Voltage
12V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
2.5uA
Voltage(VBR)
4V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESDA33CT 产品概述

一、简介

ESDA33CT 是 Leiditech(雷卯电子)推出的一款小型瞬态抑制二极管(TVS),专为 3.3V 工作电压的信号线、数据线和接口口防护设计。器件封装为 SOD-523,体积极小,适合空间受限的移动设备、便携终端及高速接口保护。其主要用于吸收静电放电(ESD)、电快速瞬变脉冲(EFT)及浪涌(Surge)能量,保护后端敏感芯片不受瞬态过压损害。

二、主要特性

  • 工作电压 Vrwm:3.3V,适配 3.3V 系统
  • 钳位电压:12V(峰值钳位,可在冲击时限制电压幅值)
  • 峰值脉冲电流 Ipp:8A(一次脉冲承受能力)
  • 击穿电压 Vbr:4V(典型)
  • 反向电流 Ir:2.5μA(在 Vrwm 下的小漏电流)
  • 结电容 Cj:18pF(对信号完整性有一定影响,适用于容忍此电容的接口)
  • 工作温度范围:-55℃ 至 +125℃
  • 符合 IEC 61000-4-2 / 4-4 / 4-5 防护规范要求

三、典型电气参数(摘要)

  • 类型:ESD TVS 二极管
  • Vrwm:3.3V
  • Vbr:≈4V
  • 钳位电压(冲击时):12V
  • Ipp(峰值脉冲):8A
  • Ir(反向漏电):2.5μA
  • Cj:18pF
  • 封装:SOD-523(极小型封装)

四、应用场景

  • USB、UART、I2C、SPI 等接口的静电与浪涌保护(特别是 3.3V 逻辑电平系统)
  • 智能手机、平板、可穿戴设备、便携仪表的外部接口防护
  • 工业控制、楼宇自控中对数据线及传感器接口的抗干扰设计
  • 需要小尺寸封装且对瞬态保护有基本要求的消费电子设备

五、封装与 PCB 布局建议

  • 尽量将 ESDA33CT 靠近受保护的连接器或芯片输入端放置,减小引线与走线的寄生电感。
  • 提供短而宽的接地回流路径,必要时在保护元件旁增加接地过孔,连接到大面积地平面。
  • 对于高速差分信号或对电容敏感的应用,注意 18pF 的结电容可能影响信号完整性,需评估是否可接受或选择更低容值方案。
  • SOD-523 小封装适合高密度布板,但焊接、维修时需注意取放与回流温度规范。

六、可靠性与合规

ESDA33CT 设计通过 IEC 61000-4-2(静电放电)、IEC 61000-4-4(电快速瞬变)及 IEC 61000-4-5(浪涌)相关测试要求,工作温度宽,漏电低,适合长期运行环境。建议在具体应用中进行系统级的抗扰度验证,以确认钳位电压与脉冲电流对下游电路的影响在可接受范围内。

如需进一步的封装尺寸图、PCB footprint 或典型等效电路图,可提供更详细资料以便设计评审与样片测试。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.