WMSIC Electronic Components

Leiditech PESD5V0U1BA

ModelPESD5V0U1BA
PackageSOD-323
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech PESD5V0U1BA
Type
LEIDITECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
PESD5V0U1BA
Electronic Component
1
Package
SOD-323
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.025g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.6pF
Electronic Component
BM0264463868
Operating Temperature
55℃~+125℃
Voltage
10V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
200nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD5V0U1BA 产品概述

PESD5V0U1BA 是 Leiditech(雷卯电子)推出的一款单路低电容瞬态抑制(ESD)二极管,专为 USB 等高速数据接口提供静电放电与浪涌保护。器件采用 SOD-323 小封装,工作温度范围宽 (-55 ℃ 至 +125 ℃),针对现代便携设备和精密接口的抗扰度与信号完整性做了优化设计。

一、主要特性

  • 反向截止电压 Vrwm:5 V(适配 5V 总线电压)
  • 击穿电压 VBR:6 V(保证在正常工作电压下稳定)
  • 钳位电压(典型):10 V(在浪涌/ESD 事件中有效钳制)
  • 峰值脉冲功率 Ppp:350 W @ 8/20 μs(单次脉冲能量吸收能力强)
  • 反向电流 Ir:200 nA(超低泄漏,适合低功耗系统)
  • 结电容 Cj:典型 0.6 pF(极低电容,最小化对高速信号的影响)
  • 通道数:单路(单通道对地保护)
  • 封装:SOD-323(小体积,便于在受限面积 PCB 上布局)
  • 工作温度:-55 ℃ ~ +125 ℃
  • 防护等级:符合 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5 等工业抗扰度标准

二、优点与设计考量

  • 低电容(0.6 pF):对 USB、USB2.0 等差分高速信号影响极小,可有效保持信号上行/下行的完整性和时序。
  • 低泄漏电流(nA 级):适合电池供电或休眠场景,不会显著增加待机功耗。
  • 较高的脉冲吸收能力(350 W @8/20 μs):在遭受雷击浪涌或开关电弧瞬态时,提供可靠的能量承受能力。
  • 小封装、贴片工艺:便于自动化贴装与小型化设计,节省 PCB 面积。
  • 工业级温度范围:满足严苛环境下的长期可靠性需求。

三、典型应用

  • USB 接口(包括 USB2.0、USB OTG)保护
  • 移动终端、笔记本、平板的外部接口防护
  • 工业控制与仪表的 I/O 端口防护
  • 任何要求低电容、低泄漏并需满足 IEC ESD/Surge 规范的高速数据线保护场合

四、使用与布局建议

  • 放置位置:尽量靠近连接器或受保护信号源的入口端,减少未受保护的走线长度。
  • 布线要点:器件到接地的回流路径应尽可能短且宽,以降低钳位电压并改善能量吸收能力。
  • 与串联元件配合:在某些应用中可与小阻值串联电阻或共模滤波器配合,进一步限制冲击电流并改善滤波效果。
  • 焊接工艺:遵循 SOD-323 常规回流焊温度曲线,避免超过器件最高结温并影响可靠性。
  • 可靠性验证:在最终产品中建议进行 IEC 61000-4-2(ESD)、4-4(EFT)和 4-5(Surge)等级别的整机测试以确认保护效果。

五、选型与注意事项

PESD5V0U1BA 适用于以 5V 为工作电压的接口保护场景,若需保护更高工作电压或多通道差分信号(如 USB3.0/高速差分对),请根据电压等级与通道数选择相应型号。设计时关注结电容对信号链的影响、器件的钳位电压与系统允许的最大瞬态电压匹配,以及在高能量冲击下的热散能力与 PCB 布局。

如需样片、封装图或详细电气特性曲线(I-V、钳位特性、典型脉冲响应等),可联系 Leiditech(雷卯电子)技术支持获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.