WMSIC Electronic Components

Leiditech BV-D505ZC

ModelBV-D505ZC
PackageSOD-523
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech BV-D505ZC
Type
LEIDITECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
BV-D505ZC
Electronic Component
1
Package
SOD-523
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.021g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
15pF
Electronic Component
BM0257609368
Voltage
12V
Electronic Component
IEC 61000-4-5
Current(Ir)
1uA
Voltage(VBR)
5.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BV-D505ZC 产品概述

一、产品简介

BV-D505ZC 是 Leiditech(雷卯电子)推出的一款单路瞬态电压抑制器(TVS),采用超小型 SOD-523 封装。器件面向 5V 级别的瞬态过电压保护场景,典型参数包括反向截止电压 Vrwm = 5V、击穿电压 Vbr ≈ 5.5V、钳位电压 Vc = 12V(峰值脉冲条件下),以及在 8/20µs 浪涌波形下可承受峰值脉冲功率 Ppp = 100W。其低漏电流(Ir = 1µA)和 15pF 的结电容(Cj)使其在低功耗和一定高速信号场合具有优势,同时满足 IEC 61000-4-5 浪涌保护等级。

二、主要性能指标

  • 反向截止电压(Vrwm):5V
  • 击穿电压(Vbr):5.5V(典型)
  • 钳位电压(Vc):12V(标称,峰值脉冲条件)
  • 峰值脉冲功率(Ppp):100W @ 8/20µs
  • 反向电流(Ir):1µA(在 Vrwm 条件下)
  • 结电容(Cj):15pF
  • 通道数:单路
  • 防护等级:符合 IEC 61000-4-5 浪涌标准
  • 封装:SOD-523(超小型)

三、特点与优势

  • 小尺寸:SOD-523 封装占板面积小,便于消费类电子和移动设备中空间受限的设计。
  • 高能量吸收能力:在 8/20µs 波形下 100W 峰值能力,可应对典型的电源或接口浪涌脉冲。按钳位电压 12V 计,峰值冲击电流约为 8A(近似值),适用于短时大电流脉冲吸收。
  • 低漏电流:1µA 等级有利于电池供电或低功耗系统,减少待机损耗。
  • 适度结电容:15pF 的 Cj 对某些高速数据线有影响,适合电源线、控制线或对高速损耗不敏感的信号保护。
  • 符合 IEC 浪涌标准:适合在需要达到工业级浪涌防护要求的应用场景使用。

四、典型应用场景

  • USB、GPIO、I2C、UART 等接口的过压与浪涌保护(针对低速或电源侧应用更为合适)。
  • 移动设备、可穿戴设备的电源浪涌保护。
  • 工业控制终端、通信设备接口保护,需满足 IEC 61000-4-5 的设备。
  • 车载电子(非关键高可靠回路)与消费类电子的局部瞬态抑制(请结合系统完整性评估选择器件)。

五、布板与使用建议

  • 器件应尽量靠近被保护端口或连接器放置,最小化引线和走线长度,以降低有效串联阻抗。
  • 对于单向配置:一般将阳极接地、阴极接至被保护线路;若需要双向保护,请确认器件具体极性或选用双向型号。
  • 在高能量吸收场景下,保证附近地平面完整,必要时增加多点接地或旁路电容以改善能量分散。
  • 结电容 15pF 在高速差分信号上可能引入失真,若用于高速接口(如 USB2.0/USB3.0 等),需评估信号完整性;对电源或慢速信号优先考虑使用。
  • 考虑热量集中问题,尽管 SOD-523 封装体积小,但在重复浪涌或高能量条件下需注意 PCB 散热和器件退化。

六、选型与采购提示

  • 确认应用是单向还是双向保护,若需要双向保护请向供应商索要相应型号或明确极性。
  • 在要求更低结电容的高速口保护时,比较不同型号的 Cj 值,选择对信号影响最小的器件。
  • 参考 Leiditech 的完整数据手册获取温度特性、浪涌能量曲线和典型钳位随电流变化曲线,以便在系统级进行精确仿真与设计。

总结:BV-D505ZC 以其 5V 级别的低 Vrwm、较高的瞬态功率能力和超小封装,适合空间受限且需要抗浪涌保护的低压应用。对功率吸收能力、结电容敏感度及是否需要单/双向保护的系统设计约束,建议在最终选型前做针对性的电磁兼容和信号完整性评估。

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