WMSIC Electronic Components

LOWPOWER LP3997-18QVF

ModelLP3997-18QVF
PackageDFN-4-EP(1x1)
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP3997-18QVF
Type
LOWPOWER
Minimum package
10000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
60uVrms
Electronic Component
LP3997-18QVF
Electronic Component
1
Package
DFN-4-EP(1x1)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.013g
Electronic Component
1
Features
Output
Electronic Component
BM0263564588
Operating Temperature
40℃~+150℃@(Tj)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
1.8V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP3997-18QVF 产品概述

一、产品简介

LP3997-18QVF 是微源半导体(LOWPOWER)推出的一款超低功耗、低噪声、固定输出线性稳压器,专为对电源噪声与功耗敏感的便携与嵌入式应用设计。器件采用 DFN-4-EP (1×1 mm) 超小封装,单通道正输出,输出电压为 1.8V,最大输出电流可达 300mA,输入允许最高 6V。内部集成过热保护,保证工作可靠性并简化系统设计。

二、主要电气参数(概要)

  • 输出类型:固定(1.8V)
  • 输入电压:最高 6V
  • 输出电流:最大 300mA
  • 静态电流(Iq):典型 2µA(超低静态电流,适合电池供电)
  • 噪声:60µVrms(低输出噪声,利于模拟与射频前端)
  • 电源纹波抑制比(PSRR):65dB(中低频段优秀抑制能力)
  • 保护功能:过热保护(OTP)
  • 工作温度范围:-40℃ ~ +150℃(以结温 Tj 标称)
  • 封装:DFN-4-EP (1×1)(带外露散热焊盘)
  • 通道数:1,输出极性:正极

三、特点与优势

  • 低静态电流:典型 2µA,有利于延长电池寿命,适用于休眠占空比高的设备。
  • 低噪声与高 PSRR:60µVrms 噪声与 65dB PSRR 提供洁净电源,满足精密传感器与模拟前端或射频模块的供电要求。
  • 小型封装与良好散热:1×1 mm DFN-4-EP 封装节省 PCB 面积,外露焊盘便于将热量传导至 PCB。
  • 保护完善:内置过热保护提高系统可靠性,减少外部保护电路需求。

四、典型应用场景

  • 电池供电的物联网节点与可穿戴设备
  • 便携式音视频与传感器采集模块
  • 精密模数转换器(ADC)与低噪声放大器的基准/供电
  • 射频收发器前端及混频器供电(需注意整体 RF 设计)
  • 工业与医疗便携终端(满足宽温度与可靠性要求)

五、设计与布局建议

  • 输入/输出端采用低 ESR 陶瓷电容以确保稳态与瞬态性能;常见做法为在输入与输出各放置 1µF~10µF 陶瓷电容,且尽量靠近引脚布置。
  • 外露焊盘(EP)必须与 PCB 地平面良好连接,推荐在焊盘下方或周围增加过孔/盲埋孔形成导热通道,提升散热能力。
  • 布线时将电源回流路径最短最宽,模拟敏感节点远离高频开关或数字噪声源,必要时加地隔离或滤波。
  • 在高热耗场景或接近 300mA 连续输出时,应评估 PCB 散热能力并进行热仿真,避免持续高结温影响可靠性。

六、封装与采购提示

LP3997-18QVF 采用 DFN-4-EP (1×1) 超小封装,适合空间受限的移动设备与密集 PCB 布局。选型时请确认系统最大输入电压不超过 6V,且评估在最高负载与环境温度下的结温是否在允许范围内。建议参考官方数据手册获取详细电气特性曲线、典型应用电路与 PCB 布局范例,以保证设计一次通过。

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