WMSIC Electronic Components

LOWPOWER LP3993-33B3F

ModelLP3993-33B3F
PackageSOT-23
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP3993-33B3F
Type
LOWPOWER
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
300mV@(100mA)
Electronic Component
LOWPOWER
Electronic Component
LP3993-33B3F
Electronic Component
1
Package
SOT-23
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0229474280
Operating Temperature
40℃~+85℃@(Tj)
Operating Voltage
24V
Output
Electronic Component
Output Voltage
3.3V
Output Current
200mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP3993-33B3F 产品概述

一、简介

LP3993-33B3F 是微源半导体(LOWPOWER)推出的一款低功耗线性稳压器(LDO),为固定输出型、单通道正极输出器件。器件标称输出电压为 3.3V,适用于对噪声、纹波抑制和低静态电流有较高要求的便携与工业应用。封装为常用的 SOT-23,便于空间受限的电路板布局与大规模贴片生产。

二、主要性能参数

  • 输出类型:固定(3.3V)
  • 输入工作电压:最高可支持至 24V(设计适配较宽输入范围)
  • 典型/额定输出电流:200mA(设计允许短时峰值可达 300mA)
  • 压差(Dropout):300mV @ 100mA
  • 静态电流(Iq):典型 5µA,适合电池供电与低功耗休眠场景
  • 电源纹波抑制比(PSRR):76dB @ 1kHz,抑制开关噪声和电源干扰能力强
  • 保护特性:过流保护(OCP)、过热保护(thermal shutdown)
  • 工作温度范围:-40℃ ~ +85℃(器件结温规范)
  • 输出极性:正极输出,单路通道
  • 封装:SOT-23(小封装、低成本)

三、产品亮点

  1. 低静态电流(5µA):在待机或低负载时显著降低系统静态功耗,延长电池寿命。
  2. 高 PSRR(76dB@1kHz):对来自电源或开关器件的中低频干扰具有良好抑制,适合对模拟或 RF 前端敏感的应用。
  3. 低压差(300mV@100mA):在中等负载下允许较小的输入-输出压差,利于降低输入电压要求与整体功耗。
  4. 保护完善:内置过流与过热保护,提高系统可靠性并简化外围保护设计。
  5. 小尺寸封装(SOT-23):适合空间受限的终端产品与高密度 PCB 布局。

四、典型应用场景

  • 物联网终端、无线模组、蓝牙/LoRa 等低功耗通信设备;
  • 电池供电的传感器节点与可穿戴设备;
  • 工业控制器、仪表与数据采集模块的局部稳压;
  • 模拟电路与射频前端需要低噪声电源的场合;
  • 任意需将较高输入电压(如 5V、12V 或更高)稳压至 3.3V 的小功率系统。

五、设计与布局建议

  • 输入与输出旁路:建议在输入端放置 0.1µF 陶瓷去耦,输出端按实际负载与稳定性要求选择低 ESR 电容(典型范围 1µF–10µF),以保证环路稳定与瞬态响应。
  • 压差裕量:实际设计时需保证 VIN ≥ VOUT + 压差(并考虑温漂与负载变化);例如在 100mA 负载时,VIN 最低应留 ≥3.3V + 0.3V = 3.6V,再加上安全裕量。
  • 热管理:SOT-23 封装热阻较大,高持续功耗条件下需通过铜箔散热、加大地平面或使用过孔来引导热量,以避免触发过热保护或影响可靠性。
  • 布线注意:输入端与输出端的走线应尽量短且宽,输入旁路电容要靠近器件引脚放置以降低环路阻抗,地线采用单点或局部接地以减少噪声环路。

六、可靠性与注意事项

  • 使用环境温度接近上限时,器件的输出能力与耐受功耗会下降,请做好热设计与功耗评估。
  • 若需长期大电流输出(接近 200–300mA),应评估封装散热能力及板级热阻,必要时降载或改用更大封装器件。
  • 产品偏好配合合格的输入电源源头,防止瞬态过压或浪涌对 LDO 造成损害。

总结:LP3993-33B3F 将超低静态电流、高 PSRR 与小体积封装结合,适合电池供电与对噪声敏感的 3.3V 电源需求场景。在满足输入电压与热设计条件下,可为便携、物联网与工业类终端提供稳定可靠的低噪声电源解决方案。若需更详细的电气规格、引脚图与典型应用电路,请参考厂家完整数据手册。

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