WMSIC Electronic Components

LOWPOWER LP103SB6F

ModelLP103SB6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP103SB6F
Type
LOWPOWER
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BC 1.2;QC 2.0;FCP;SFCP;QC 3.0
Electronic Component
LOWPOWER
Electronic Component
LP103SB6F
Electronic Component
1
Package
SOT-23-6
Type
Controller
Electronic Component
Fast-Charge Protocol IC
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0229474293
Operating Temperature
40℃~+105℃
Operating Voltage
3.1V~6.3V
Output Voltage
5V;20V;12V;9V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP103SB6F 产品概述

LP103SB6F 是微源半导体(LOWPOWER)推出的一款小封装、低功耗稳压器系列产品,采用 SOT-23-6 封装,面向便携设备与工业控制等对体积、温度稳定性有要求的电源管理场景。该系列提供多种固定输出电压版本(5V、9V、12V、20V),工作温度范围宽 (-40℃ ~ +105℃),适应恶劣环境和宽温差应用。

一、主要特性

  • 多种固定输出电压可选:5V、9V、12V、20V,便于在不同系统电压架构中使用。
  • 封装小巧:SOT-23-6,节省 PCB 面积,适合空间受限的设计。
  • 宽温度范围:-40℃ 至 +105℃,确保在工业级与户外环境下长期可靠工作。
  • 低功耗设计:适合电池供电或待机功耗受限的系统(具体静态电流请参阅数据手册)。
  • 内置保护机制:通常包含过流保护与热关断功能,提升系统可靠性(实际功能以厂方规格为准)。

二、典型应用场景

  • 便携式设备:移动仪表、便携终端、便携式测试设备等,需小体积与低待机功耗。
  • 工业控制:传感器接口、现场控制器、电源分配模块等,要求宽温工作与稳定输出。
  • IoT 与物联网终端:低功耗节点、网关电源管理。
  • 消费电子:路由器、机顶盒、音视频设备的局部稳压方案。

三、封装与引脚

该产品采用 SOT-23-6 封装,适合自动贴装与回流焊工艺。SOT-23-6 常见的引脚功能包括输入(IN)、输出(OUT)、地(GND)、使能(EN)、反馈/参考(FB/REF)等。具体引脚定义、管脚排列图以及外围滤波/补偿电容要求,请参照制造商提供的数据手册,以确保稳定性与电磁兼容性。

四、设计注意事项

  • 输出端推荐使用低 ESR 的旁路电容以保证环路稳定,电容尺寸与类型应按数据手册建议选择。
  • 输入端建议加足够的去耦电容以抑制输入纹波与瞬态响应。
  • 在高温或高功耗场景下需考虑散热路径与 PCB 铜箔面积,保证器件不进入热关断区。
  • 若系统对上电顺序或软启有要求,请使用带使能(EN)引脚的版本,并按规范设计上电逻辑。

五、产品优势总结

LP103SB6F 系列结合小封装、宽温性能与多电压选型,为空间受限且对可靠性有要求的电源设计提供了灵活解决方案。凭借微源半导体在低功耗器件领域的经验,该系列适合从消费电子到工业级应用的广泛场景。欲了解更详细的电气参数、典型性能曲线及布局建议,请参考 LOWPOWER(微源半导体)官方数据手册及参考设计。

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