WMSIC Electronic Components

LOWPOWER LPA2103AQVF

ModelLPA2103AQVF
PackageDFN-8-EP(2x2)
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LPA2103AQVF
Type
LOWPOWER
Minimum package
4000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LPA2103AQVF
Electronic Component
1
Package
DFN-8-EP(2x2)
Electronic Component
Audio Power Amplifier
Electronic Component
0.042g
Electronic Component
75dB
Electronic Component
1
Power Amplifier Type
D Power Amplifier
Features
Filter; /; / Switch
Electronic Component
BM0230808559
Operating Voltage
2.5V~5.5V
Output Power
2.5W×1@4Ω;2.2W×1@4Ω
Static Current(Iq)
4mA
Speaker Channel Count
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPA2103AQVF 产品概述

一、产品简介

LPA2103AQVF 是微源半导体(LOWPOWER)推出的一款单声道 D 类音频功放,专为便携、低功耗和空间受限的消费类电子设备设计。芯片工作电压范围为 2.5V 至 5.5V,具有高效率、低静态功耗和良好的音频指标,适合驱动 4Ω 小功率扬声器,满足对声音质量与续航要求同时较高的应用场景。

二、主要性能参数

  • 功放类型:D 类(Class-D)
  • 扬声器通道数:单声道(Mono)
  • 输出功率:2.5W × 1 @ 4Ω;2.2W × 1 @ 4Ω(典型)
  • 工作电压:2.5V ~ 5.5V
  • 总谐波失真 + 噪声(THD+N):0.02%
  • 静态电流(Iq):4 mA
  • 信噪比(SNR):75 dB
  • 输入类型:差分 / 单端(支持两种输入模式)
  • 电源纹波抑制比(PSRR):75 dB
  • 封装:DFN-8-EP(2 × 2 mm,带散热焊盘)

三、核心优势

  • 低静态电流:4 mA 待机电流有助于延长电池供电设备的续航时间。
  • 高音质表现:0.02% 的 THD+N 和 75 dB 的 SNR,能在小功率输出下保持良好的音频保真度。
  • 宽电源范围:2.5V–5.5V 支持多种电池或单电源方案,适配 1 芯至 3 芯锂电等应用。
  • 紧凑封装与良好散热:DFN-8-EP 小尺寸利于空间受限的产品布局,底部散热焊盘便于 PCB 导热。

四、应用场景

  • 便携蓝牙音箱、迷你音箱
  • 穿戴设备与智能配件(如智能手环、音频手持设备)
  • 智能家居与物联网终端的语音提示/报警扬声器
  • 便携媒体播放器、教育玩具等低功率声源驱动

五、设计与使用建议

  • 电源滤波:在 VDD 近端放置低 ESR 电解或陶瓷电容(例如 1 µF–10 µF)及 0.1 µF 陶瓷旁路,有助于降低电源纹波并提高 PSRR 表现。
  • 输入连接:芯片支持差分与单端输入。使用单端输入时,注意按推荐电路将未使用的输入端正确偏置或接地以避免噪声。
  • 输出匹配:根据扬声器与系统需求决定是否加入输出滤波器(LC)以优化电磁兼容(EMC)与听感;若使用带滤波的扬声器或系统板级设计,可省略外部滤波。
  • PCB 布局:DFN-8-EP 的底部露铜焊盘必须良好焊接至接地层以利散热;模拟地与数字地合理分离并在电源入口处并联接地,以减少开关噪声回流。
  • 热管理:尽管单通道功率较小,但在满载或高环境温度下需确保 PCB 有足够散热路径,避免长期高温影响可靠性。

六、典型电路与调试要点

  • 上电顺序:建议先上电 VDD,再接入输入信号,避免打拍或爆音。
  • 静态检查:无负载时测量静态电流是否接近 4 mA,异常高则检查封装焊接及电源旁路。
  • 音频调试:使用差分输入可提高抗干扰能力;若噪声偏高,检查 PCB 地回路与过滤元件布局。

七、总结

LPA2103AQVF 以其低功耗、小封装与较高的音频性能,适合对体积与续航有严格要求的便携音频产品。合理的电源滤波与 PCB 布局能充分发挥其 75 dB PSRR、0.02% THD+N 等指标带来的音质优势。对于需要单声道高效驱动 4Ω 扬声器的设计,LPA2103AQVF 是一款值得考虑的解决方案。

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