WMSIC Electronic Components

LOWPOWER LP6450B6F

ModelLP6450B6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP6450B6F
Type
LOWPOWER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP6450B6F
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.051g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230634440
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
4.2V~18V
Switching Frequency
1.2MHz
Electronic Component
Electronic Component
Output Voltage
600mV~7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP6450B6F 产品概述

一、产品简介

LP6450B6F 是 LOWPOWER(微源半导体)推出的一款高集成度降压型开关稳压器,采用同步整流架构并内置开关管,封装为 SOT-23-6。器件工作电压范围为 4.2V 至 18V,输出可调范围 600mV 至 7V,最大输出电流可达 2A,开关频率为 1.2MHz,静态电流(Iq)仅 320μA,典型工作温度范围 -40℃ 至 +85℃(TA)。该器件面向对体积、效率与成本有综合要求的嵌入式供电方案。

二、主要特性

  • 输入电压:4.2V ~ 18V,适配单节锂电或常见车用/工业电源。
  • 输出电压:600mV ~ 7V,可通过外部电阻分压调节,最低参考点 600mV。
  • 最大输出电流:2A,适合中等功率点的点对点供电或子模块供电。
  • 开关频率:1.2MHz,利于使用小体积外围电感与电容,整体方案尺寸小。
  • 同步整流:降低整流损耗,提高中高效率表现,尤其在高负载时收益明显。
  • 低静态电流:320μA,有利于待机功耗控制。
  • 封装:SOT-23-6,适合空间受限的应用。

三、典型应用场景

  • 手持设备与便携终端的降压供电
  • 单节锂电池到子系统(如模拟电路、MCU、传感器)电源
  • 工业控制器、嵌入式模块的局部稳压电源
  • 通信设备与车载电子的次级稳压

四、设计与使用要点

  • 输出电压设定:由于参考电压为 600mV,可采用标准分压公式 VOUT = 0.6V × (1 + Rtop/Rbottom) 设定所需输出。建议下端电阻(接地端)取 10kΩ~100kΩ 量级,兼顾功耗与抑噪。
  • 电感选择:开关频率高(1.2MHz),可选小体积功率电感以减小方案尺寸。设计时按期望电流纹波(一般取 20%~40% IOUT)计算电感量,注意电感饱和电流需大于最大输出电流。
  • 输入/输出电容:使用低 ESR 陶瓷电容作输入与输出滤波,输入侧尽量靠近器件电源引脚放置以抑制开关尖峰;输出电容需保证在最大负载时的电压纹波和瞬态响应。
  • 布局要点:开关节点(SW)、输入电容、器件 GND 形成最小回流环路,尽量缩短并加宽走线;将感性元件与器件放置成紧凑布局,减小辐射与寄生电感。
  • 热管理:SOT-23-6 封装在 2A 输出下会产生一定热量,尤其在高 Vin 与低 Vout 场景下。建议在 PCB 上增加散热铜箔并优化走线,必要时通过底层铜铺和过孔导热。

五、可靠性与保护建议

规格说明中列示核心性能指标;在实际系统中建议增加必要的输入保护(如 TVS、熔断器)与输出滤波/限流措施,以防输入浪涌或负载异常对器件造成应力。同时在关键产品上应做热仿真与长期老化测试以验证可靠性。

六、总结

LP6450B6F 以其宽输入、可调输出、同步整流与 1.2MHz 高频工作特点,适合体积受限且追求效率与低待机功耗的中小功率降压场景。合适的外围器件选择与严谨的 PCB 布局可确保器件在 2A 输出能力下提供稳定、高效的电源支持。若需电路参考或评估特定应用的热/电性能,可结合实际负载条件进一步优化元件选型与布局。

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