WMSIC Electronic Components

LOWPOWER LP4069TQVF

ModelLP4069TQVF
PackageDFN-8-EP(2x2)
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP4069TQVF
Type
LOWPOWER
Minimum package
4000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP4069TQVF
Electronic Component
1
Package
DFN-8-EP(2x2)
Electronic Component
Battery Management
Electronic Component
0.037g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0229962557
Operating Temperature
20℃~+85℃
Operating Voltage
4.5V~28V
Battery Type
Battery
Battery
1
ICType
IC
Static Current(Iq)
160uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP4069TQVF 产品概述

一、产品简介

LP4069TQVF是微源半导体(LOWPOWER)推出的一款单节锂离子/锂聚合物电池充电管理芯片,封装为DFN-8-EP (2×2)。芯片针对便携式和低功耗系统的电池充电需求设计,集成必要的充电控制与温度检测接口,可在有限空间内实现安全、可控的充电方案。

二、主要参数

  • 最大充电电流:800 mA
  • 工作电压(输入):4.5 V ~ 28 V
  • 芯片静态电流(Iq):160 μA
  • 电池节数:1 节(单节锂电)
  • 充电饱和电压(CV):4.2 V
  • 工作温度范围:-20 ℃ ~ +85 ℃
  • 电池温度检测:支持(外接NTC等温度传感器)
  • 封装:DFN-8-EP (2×2)

三、充电方式与功能亮点

LP4069TQVF采用典型的恒流-恒压(CC/CV)充电策略,先以设定的最大电流对电池进行恒流充电,当电池电压逼近4.2 V时切换到恒压充电并逐步降低电流直至终止。芯片支持外接温度检测元件,可在电池温度异常时限制或停止充电,提升安全性。低静态电流设计使其在系统待机或无电池时对电源消耗极小,适合电池供电要求严苛的便携设备。

四、典型应用场景

  • 便携式消费电子(智能手持设备、蓝牙设备)
  • 物联网终端与传感器节点
  • 小型可穿戴设备与健康监测仪器
  • 后备电源与单节锂电充电模块

五、封装与热管理建议

DFN-8-EP 带底部散热垫,建议在PCB上配备过孔与完整的焊盘接地、为热垫设计大铜箔并与地平面相连以提升散热性能。布板时把电池连接线、感测电阻及旁路电容尽量靠近芯片引脚,减少走线阻抗和噪声耦合。输入端使用适当的去耦电容,电池侧加稳定的旁路电容以保证充电稳定性。

六、设计与使用注意事项

  • 最大充电电流限制为800 mA,实际设计中应根据电池规格与热条件设置合理的编程电阻或限流元件。
  • 使用电池温度检测时,按电池厂商建议选择NTC阻值与阈值,确保在低温或高温下正确限制充电。
  • 建议在系统中配置电池保护电路(过充/过放保护)与熔断/限流器件,满足安全规范。
  • 输入端需考虑瞬态抑制与反接保护以提高系统可靠性。

七、产品优势与总结

LP4069TQVF以宽输入电压(4.5–28 V)、较高的充电电流能力(800 mA)、低静态电流(160 μA)和单节4.2 V精确恒压点为特点,适用于对体积、功耗和安全性都有要求的单节锂电应用。DFN-8-EP小封装有利于紧凑设计,同时底部散热垫便于热管理,是为中小功率便携式产品提供简洁可靠充电管理的合适选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.