WMSIC Electronic Components

LOWPOWER LP5308B6F

ModelLP5308B6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP5308B6F
Type
LOWPOWER
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP5308B6F
Electronic Component
1
Package
SOT-23-6
Type
Switch
Electronic Component
Power Electronic Switch
Electronic Component
0.039g
Electronic Component
1
Channel Count
1
Features
Output
Electronic Component
BM0228976590
Resistor
135mΩ
Operating Temperature
40℃~+85℃
Operating Voltage
3V~36V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP5308B6F 产品概述

一、简介

LP5308B6F 是微源半导体(LOWPOWER)推出的一款高侧开关,面向工业、汽车及通用电源管理场景。该器件支持 3V 至 36V 的宽输入电压范围,采用 SOT-23-6 小封装,集成多种保护功能,简化电源与负载控制设计,适用于对空间、可靠性和保护功能有要求的系统。

二、主要规格

  • 类型:高侧开关(高侧功率管集成)
  • 输入控制逻辑:低电平有效(EN/控制端低电平导通)
  • 工作电压:3V ~ 36V
  • 导通电阻:典型 RDS(on) = 135 mΩ
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SOT-23-6
  • 集成功能:过热保护(OTP)、过压保护(OVP)、短路保护(SCP)、欠压保护(UVP)、过流保护(OCP)

示例功耗估算:在 1A 电流条件下,导通损耗约 P = I^2·RDS ≈ 0.135 W,便于进行热设计评估。

三、保护与可靠性

LP5308B6F 集成了热关断、过压、欠压、短路与过流保护,可在异常工况下保护系统和负载。各保护一般表现为限流或关断,具体的触发阈值、动作与复位策略(例如自动恢复或锁定)请参照产品数据手册。器件工作温度范围宽,适用于多数工业与汽车电子环境。

四、典型应用与设计建议

  • 应用场景:车载电源开关、继电器替代器、分支电源管理、工业控制模块、便携设备电源保护等。
  • 布局与外围:输入侧建议并联高频去耦电容以抑制瞬态;对汽车或含干扰的输入侧可加 TVS;EN 信号为低有效,建议上拉至 VIN 或 MCU 输出并使用 RC 滤波以避免误触发。
  • 热管理:根据系统最大电流估算功耗并评估 PCB 散热(铜箔面积、过孔)。在高电流长期工作场合,注意靠近器件的散热布局。
  • 故障处理:若系统对短路或过流要求特别严格,可结合外部限流器、熔断器或电流检测回路实现冗余保护。

五、封装与选型要点

SOT-23-6 小封装利于空间受限设计,但热阻相对较大,选型时需综合 RDS(on)、工作电压范围、保护特性与热性能。对关键参数(如保护阈值、故障恢复模式、最大持续电流等)有严格要求的设计,应以正式数据手册为准并做实际测评。

总结:LP5308B6F 以宽电压输入、集成多重保护和紧凑封装为特点,适合需要可靠高侧电源控制且受限于空间的应用场景。具体电气参数与典型应用电路建议参考微源半导体官方资料以完成最终设计。

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