WMSIC Electronic Components

LOWPOWER LP28053ASPF

ModelLP28053ASPF
PackageESOP-8
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP28053ASPF
Type
LOWPOWER
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP28053ASPF
Electronic Component
1
Package
ESOP-8
Electronic Component
Battery Management
Electronic Component
0.151g
Electronic Component
1
Features
Programmable Current; Current
Electronic Component
BM0230595835
Operating Temperature
40℃~+85℃
Operating Voltage
4.4V~6.5V
Battery Type
Battery
Battery
1
ICType
IC
Static Current(Iq)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP28053ASPF — 单节锂电池充电管理芯片产品概述

一、产品简介

LP28053ASPF 是 LOWPOWER(微源半导体)面向单节锂离子/锂聚合物电池的高集成充电管理芯片。芯片工作电压范围宽(4.4V~6.5V),最大充电电流可达 1A,恒压充电饱和电压为 4.2V,适用于便携设备及对待机功耗要求严格的低功耗应用场景。器件采用 ESOP-8 封装,工作温度范围 -40℃~+85℃,并支持电池温度检测功能,静态电流仅 1μA,非常适合电池供电的物联网终端、便携式测量仪和低功耗消费电子产品。

二、主要规格与特性

  • 芯片类型:充电管理芯片(单节锂电池)
  • 输入工作电压:4.4V ~ 6.5V(支持常见 USB/适配器电源)
  • 最大充电电流:1A(可通过外部元件设定)
  • 充电饱和电压:4.2V(恒压充电精度保证电池寿命)
  • 电池节数:1 节锂电池(Li-ion / Li-polymer)
  • 电池温度检测:支持(通常通过外接 NTC 实现)
  • 静态电流(Iq):1μA(超低静态电流,利于节省待机功耗)
  • 工作温度:-40℃ ~ +85℃
  • 封装:ESOP-8

其他典型特性(器件级设计常见,便于系统集成):

  • 标准恒流-恒压(CC/CV)充电曲线
  • 充电状态指示与外部使能控制(常见有 STAT、EN 引脚)
  • 多重保护机制(过温保护、电池温度监测、输入欠压/过压保护等)
  • 小封装、低外部元件数目,易于 PCB 集成

三、工作原理与充电流程

LP28053ASPF 遵循标准的 CC/CV 充电流程:当电池电压低于设定点时,芯片以恒流模式对电池进行快速充电(恒流值可通过外接电阻或系统配置设定,最高 1A);当电池电压接近 4.2V 后切换到恒压模式,维持 4.2V 直到充电电流下降到终止条件(进入涓流或停止充电)。芯片支持电池温度检测,若检测到温度异常将限制或终止充电以保护电池安全。宽输入电压范围使其兼容常见的 5V 电源和部分高于 5V 的电源输入。

四、典型应用场景

  • 便携式电子设备(蓝牙设备、手持仪器、体感设备)
  • 物联网终端与传感器节点(要求低静态电流与长待机时间)
  • 可充电电池组的备用电源管理
  • 小型充电座与移动电源管理子模块

五、设计与布局建议

  • 外部电容:建议在输入端与电池端分别配置低 ESR 陶瓷电容(例如 1μF~10μF 范围,具体按应用与稳定性需求选择),以降低纹波并保持充电稳定。
  • 充电电流设定:若芯片采用编程电阻设定充电电流,需按芯片数据手册计算并选择合适功率与精度的电阻。
  • 电池温度检测:使用 10kΩ NTC(或与器件规格匹配的 NTC)连接到 TS/温度检测引脚,确保在极端温度下能正确限制充电。
  • PCB 布局:输入电源和电池电流回路应尽量缩短并加宽走线,靠近芯片放置充放电电阻与电容,提供良好散热路径。ESOP-8 的底部或靠近 GND 引脚区域应考虑加铜平面以改善热分散。
  • 热量管理:在高充电电流(接近 1A)下,芯片会产生显著热量,建议在 PCB 设计中提供散热铜箔与合适的过孔,必要时选择降额使用或添加外部散热结构。

六、封装与可靠性

ESOP-8 封装兼顾小型化与散热性能,适合空间受限的便携设备。芯片的工业级工作温度(-40℃~+85℃)满足大多数户外与工业环境的可靠性需求。实际使用中应参考器件完整数据手册进行应力和寿命评估,特别是在高温或长时间高电流充放电工况下。

七、选型与注意事项

选择 LP28053ASPF 时,请确认系统电源电压与充电电流要求在器件额定范围内;如系统需要更高电流或多节电池支持,应考虑相应的型号或并联/级联方案。建议参考 LOWPOWER(微源半导体)提供的典型应用电路与 PCB 布局范例,以保证性能与安全性。

如果需要,我可以根据您的具体应用(输入电源类型、电池容量、目标充电时间、PCB面积限制等)提供一份参考原理图和外部元件清单。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.