WMSIC Electronic Components

LOWPOWER LP4076HSPF-435

ModelLP4076HSPF-435
PackageESOP-8
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP4076HSPF-435
Type
LOWPOWER
Minimum package
4000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP4076HSPF-435
Electronic Component
1
Package
ESOP-8
Electronic Component
Battery Management
Electronic Component
0.181g
Electronic Component
1
Features
Programmable Current; Current
Electronic Component
BM0229943296
Operating Temperature
20℃~+85℃
Operating Voltage
4.5V~28V
Battery Type
Battery
Battery
1
ICType
IC
Static Current(Iq)
2uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP4076HSPF-435 产品概述

LP4076HSPF-435 是微源半导体(LOWPOWER)推出的一款单节锂电池充电管理芯片,封装为 ESOP-8。芯片支持最高 1A 的充电电流,具有超低静态电流(Iq = 2 μA),适合对待机能耗敏感且需从较宽输入电压范围供电的便携设备与工业应用。充电采用恒流-恒压(CC-CV)策略,充电饱和(终止)电压为 4.35V,并支持电池温度检测功能以保障充电安全。

一、主要特性

  • 最大充电电流:1A(可配置/限流)
  • 静态电流(Iq):2 μA(低待机功耗)
  • 电池类型:单节锂离子/锂聚合物电池
  • 工作输入电压范围:4.5V ~ 28V,适应宽电源场景
  • 终止电压(充电饱和电压):4.35V
  • 支持电池温度检测(外接 NTC/温度检测接口)
  • 封装:ESOP-8,便于散热与焊接
  • 品牌:LOWPOWER(微源半导体)

二、功能说明

LP4076HSPF-435 以线性/开关混合或线性架构为基础实现 CC-CV 充电,实现对单节锂电池的安全、可靠充放电管理。其关键功能包括充电电流限制、恒压保持、温度检测关断/限制、短路与过温保护,以及低静态电流以降低待机能耗。芯片内部具有精确参考与控制回路,保证终止电压与恒流精度。

三、保护与可靠性

  • 电池温度监控:通过外接温度传感器(NTC)或芯片 TS 引脚实现充电温度判断,超温或过冷自动停充或限制充电电流。
  • 过温保护:当内部或外部温度超过安全阈值时限制或停止充电,并在温度恢复后自动恢复。
  • 过压/欠压检测:输入与电池端均具检测机制,防止异常电压损坏电池或芯片。
  • 反向电流与短路防护:防止电池向输入侧反向放电和输出短路造成损害(具体保护行为以 datasheet 为准)。

四、电气规格重点(用户需关注)

  • 输入电压上限 28V:在高电压供电场景需注意功耗与散热,必要时用外部限流或降压措施减小芯片功耗。
  • 最大充电电流 1A:当在最高输入电压下工作时,线性调节器类型芯片会产生较大耗散,应评估热沉与散热路径。
  • 静态电流 2 μA:非常适合需要长时间待机待充的产品,减少电池自放电影响。

五、封装与引脚(概述)

  • 封装形式:ESOP-8,具有良好散热性能与 PCB 可焊接性,适合自动化贴装。
  • 引脚功能通常包括:VIN(输入)、VOUT/BAT(电池连接)、GND、CHG/STAT 指示、ILIM/SET(充电电流设定)、TS(温度检测)等。具体引脚定义与布局请参考官方 datasheet。

六、设计与应用建议

  • 散热设计:在高输入电压差或接近 1A 充电时,芯片功耗显著,建议在 PCB 上提供充足铜箔、热过孔或采用散热垫以降低结温。
  • 外围元件:建议在输入端与电池端布置合适的陶瓷/低 ESR 电容以稳定回路,温度检测使用标准 NTC(例如 10k)并按 datasheet 建议接入 TS 引脚。
  • 电流设定:如需低于 1A 的充电电流,通过 datasheet 指定的编程电阻或外部器件进行设定,避免直接超出芯片额定值。
  • EMC 与滤波:在工业或噪声较大的环境中,加入输入滤波与保护器件(TVS、输入限流)以提升系统可靠性。

七、典型应用场景

  • 消费类便携产品:移动电源、无线耳机充电仓、蓝牙音箱等;
  • 工业与仪器:现场采集终端、通信设备的备用电池管理;
  • 低功耗物联网设备:需要长待机并偶尔充电的单节锂电池系统。

总结:LP4076HSPF-435 集成度高、静态电流低、支持 4.5V–28V 宽输入并兼顾单节锂电池的安全管理,适合对功耗与散热有综合考量的应用。实际设计时请以官方 datasheet 为准,结合散热与外围元件布局进行系统级优化。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.