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LOWPOWER LP3110B6F
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LOWPOWER LP3110B6F
- Type
- LOWPOWER
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LOWPOWER
- Electronic Component
- LP3110B6F
- Electronic Component
- 1
- Package
- SOT-23-6
- Electronic Component
- Charge Pump
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Features
- Output
- Type
- Electronic Component
- Electronic Component
- BM0230595841
- Operating Temperature
- 20℃~+85℃
- Operating Voltage
- 2.8V~5V
- Switching Frequency
- 340kHz
- Static Current(Iq)
- 2mA
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LP3110B6F 产品概述
一、产品简介
LP3110B6F 是 LOWPOWER（微源半导体）推出的一款高集成度升压稳压器，面向便携与低功耗应用场景。器件输入电压范围宽（Vin：2.8V ～ 5V），内部电路优化以降低静态功耗（静态电流 Iq≈2mA），输出固定为 5V，封装为业界常用的 SOT-23-6，便于在体积受限的产品中实现稳定的升压供电。
二、主要技术参数
- 工作电压（Vin）：2.8V ～ 5V
- 输出电压（Vout）：5V（固定或外部设定，详见数据手册）
- 静态电流（Iq）：约 2mA（低功耗待机有利于电池应用）
- 功能类型：升压（Boost）稳压器
- 封装：SOT-23-6（小型化，适合贴片生产）
（注：上列为产品基本参数，设计时请以官方数据手册与典型应用电路为准。）
三、核心优势与功能亮点
- 低输入电压启动与稳压：支持从 2.8V 起稳定工作，适配多数单节电池与常见电源轨。
- 低静态电流：约 2mA 的静态电流对延长电池寿命有显著帮助，适合需要长期待机的物联网与便携设备。
- 小尺寸封装：SOT-23-6 封装有利于空间受限的整机布局，减少占板面积。
- 集成度高：内部集成多项控制功能（开启/关闭、保护机制等），外部器件数量少，简化 BOM。
四、典型应用场景
- 便携式设备和手持终端（要求 5V 外设供电）
- 物联网节点与传感器模块（需低功耗待机）
- 便携式充电器或小型电源模块
- 智能家居控制器、可穿戴设备（在满足输入电压范围下）
五、封装与引脚（示例说明）
LP3110B6F 采用 SOT-23-6 封装，常见引脚功能包括 VIN、GND、开关端（SW）、反馈（FB）/输出检测、使能（EN）等。不同版本或具体引脚排列请参考厂商提供的数据手册与布局图。设计前务必核对原厂封装图与引脚定义，以免接错造成损坏。
六、设计与布局建议
- 输入/输出电容尽量靠近芯片 VIN 与 GND 引脚放置，以降低环路阻抗与抑制开关噪声。
- 对于功率回路，应使用足够宽的铜箔并考虑散热通道，必要时在导热路径处使用过孔连通多层铜层。
- 电感、二极管（若外置）与开关节点应短路线布置，减少寄生电感和辐射。
- 采用合适的输入滤波，以避免输入源波动影响稳压精度。
- 如果有 EN（使能）脚，建议在系统上实现软启动或控制逻辑，以防误动作。
七、采购与使用注意事项
- 采购时请通过正规渠道获取带有完整标识与质保的原厂或授权代理产品，避免采购散装或翻新元件。
- 使用前务必阅读并参照官方数据手册，确认最大额定值、热限、启动条件与典型应用电路。
- 在高温、高湿或强干扰环境下使用时，注意做好电磁兼容与散热处理以保证长期可靠性。
如需更详细的电气特性曲线、典型效率数据、参考电路与 PCB 布局图，请提供是否需要我帮您查找或梳理 LP3110B6F 的官方数据手册关键页内容。
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