WMSIC Electronic Components

LOWPOWER LP4068B5F

ModelLP4068B5F
PackageSOT-23-5
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP4068B5F
Type
LOWPOWER
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP4068B5F
Electronic Component
1
Package
SOT-23-5
Electronic Component
Battery Management
Electronic Component
0.065g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0229474295
Operating Temperature
20℃~+85℃
Operating Voltage
4.5V~9V
Battery Type
Battery
Battery
1
ICType
IC
Static Current(Iq)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP4068B5F 产品概述

一、产品简介

LP4068B5F 是微源半导体(LOWPOWER)面向单节锂离子电池的充电管理芯片,采用常见的 SOT-23-5 封装,适合空间受限、成本敏感的便携式电子产品。芯片工作电压范围宽(4.5V~9V),支持最高 800mA 的充电电流,并以 4.20V 为充电饱和电压,符合单节锂电池的典型 CC/CV 充电策略。

二、主要规格(核心参数)

  • 芯片类型:充电管理芯片(单节锂电)
  • 输入工作电压:4.5V ~ 9V
  • 最大充电电流:800mA
  • 充电终止/饱和电压:4.20V
  • 适配电池类型:单节锂离子/锂聚合物电池(1 节)
  • 工作温度:-20℃ ~ +85℃
  • 静态电流(Iq):1 μA(低静态电流,适合电池供电场景)
  • 封装:SOT-23-5
  • 品牌:LOWPOWER(微源半导体)

三、关键特性与优势

  • 低静态电流:1μA 的静态电流有助于降低待机损耗,适合电池供电的物联网或低功耗终端。
  • 宽输入电压范围:4.5V~9V 兼容典型 USB 5V 电源及部分更高电压的适配器输入,灵活性好。
  • 适中充电能力:最大 800mA 的充电电流能满足中小型电池组较快充电需求,同时仍利于 SOT-23 封装下的散热管理。
  • 标准终止电压:4.2V 适配一般锂电池充电规范,便于与市面电池兼容。

四、典型应用场景

  • 可穿戴与便携设备(蓝牙耳机、手环、迷你播放器)
  • 低功耗物联网终端、无线传感器节点
  • 小型手持设备、遥控器、便携医疗监测设备
  • 以单节锂电供电的小型消费电子产品

五、设计与使用注意事项

  • 充电电流设置:芯片支持通过外部元件设定充电电流(具体编程方式请参考官方数据手册),在选择电流时须兼顾电池允许的最大充电速率和 SOT-23 封装下的热耗散能力。
  • 热管理:线性充电器的功耗约为 (Vin - Vbat) × Icharge。当 Vin 明显高于电池电压且充电电流接近上限时,封装温升和热关断必须考虑,必要时进行散热设计或限制最大充电电流。
  • 输入电源:建议在输入端添加适当的旁路电容(如陶瓷电容)以抑制电源噪声和瞬态,保证稳定工作。
  • 电池保护:本芯片为充电管理器件,不等同于电池保护 IC;推荐配合独立的电池保护电路(过放/过充/短路保护)或带有保护功能的电池使用。
  • PCB 布局:电源路径应尽量短且粗,充放电相关电阻、电容靠近芯片布局,地线处理注意散热与回流路径。
  • 环境与安全:工作温度范围为 -20℃~+85℃,在极端环境或高温条件下应验证充电性能及安全策略。

六、选型建议与结论

LP4068B5F 适合需要低静态电流、单节锂电充电且封装与成本受限的应用场景。若目标设备以 USB 5V 或类似电源为主、并且充电电流需求在数百毫安量级,此芯片为合适选择。最终方案设计前,请务必参照 LP4068B5F 的完整数据手册确认引脚功能、外部器件计算公式与保护特性,并在目标工况下进行热与可靠性验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.