WMSIC Electronic Components

LOWPOWER LP6482SOF

ModelLP6482SOF
PackageSOP-8
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP6482SOF
Type
LOWPOWER
Minimum package
4000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP6482SOF
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.144g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0257675044
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
4.5V~30V
Switching Frequency
340kHz
Electronic Component
Electronic Component
Output Voltage
600mV~12V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP6482SOF 产品概述

一、产品简介

LP6482SOF 是微源半导体(LOWPOWER)推出的一款降压型同步整流开关稳压器,采用 SOP-8 封装,集成高侧/低侧开关管,适合宽输入电压范围的高效 DC-DC 降压转换。器件工作电压 4.5V~30V,输出电压可调 0.6V~12V,最大输出电流 2A,开关频率 340kHz,典型工作温度范围 -40℃~+85℃(TA)。

二、关键参数

  • 功能类型:降压型(Buck)
  • 输入电压:4.5V~30V
  • 输出电压:0.6V~12V(可调)
  • 输出电流:最大 2A
  • 开关频率:340kHz
  • 静态电流(Iq):10mA
  • 同步整流:是(内置同步 MOSFET)
  • 开关管:内置
  • 输出通道数:1
  • 拓扑结构:降压式
  • 封装:SOP-8
  • 工作温度:-40℃~+85℃(TA)

三、主要特性与优势

  • 同步整流提高轻负载及高负载效率,减少外部肖特基二极管需求;
  • 340kHz 中等频率,外部电感与输出电容折衷良好,有利于尺寸与效率平衡;
  • 内置功率开关,简化 PCB 布局与器件选型,适合空间受限应用;
  • 低静态电流(10mA)有助于降低待机损耗(需结合系统功耗需求评估);
  • 宽输入电压范围适用于 12V/24V 供电系统(建议增加瞬态吸收与输入滤波);

四、典型功能与保护(建议)

标准降压稳压器常见保护功能包括:软启动、过流保护、过温保护以及欠压关闭。LP6482SOF 适配于需要短路/过载防护和温度管理的应用,详细保护特性请参阅芯片数据手册并在系统设计中加入必要的外部保护电路。

五、典型应用与设计要点

  • 典型应用:工业控制电源、通信设备、仪表、电源模块、LED 驱动及消费电子等(在汽车环境使用时,需做输入瞬态和电磁兼容验证)。
  • 外围元件:建议选用低 DCR、饱和电流足够的功率电感(典型 10µH~2.2µH 取决于输出电压与纹波要求),低 ESR 输入/输出电容以降低纹波。由于为同步整流,无需肖特基二极管。
  • 布局建议:输入电容靠近 VIN 引脚,回流路径短且成环,开关节点(SW)走线尽量短,放置接地平面以提升散热与 EMI 性能,SOP-8 封装需注意 PCB 散热增强。
  • 热管理:在高输入电压和大电流场景下,器件功耗上升,应考虑散热片或良好板级散热设计,必要时降额使用以保证长期可靠性。

六、总结

LP6482SOF 以其宽输入范围、可调输出、内置同步开关和中等开关频率,为需在有限空间内实现高效稳压的单路电源设计提供了可靠选择。设计时应结合负载、效率和热性能进行外部元件与 PCB 布局优化,确保系统在额定温度范围内稳定工作。若需更详细的电气特性、引脚定义与典型应用电路,请参考微源半导体官方数据手册。

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