WMSIC Electronic Components

LOWPOWER LP62610-33B6F

ModelLP62610-33B6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP62610-33B6F
Type
LOWPOWER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP62610-33B6F
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.048g
Electronic Component
1
Features
Load
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230239096
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
1V~5V
Switching Frequency
1.2MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP62610-33B6F 产品概述

一、产品简介

LP62610-33B6F 是 LOWPOWER(微源半导体)推出的一款高集成升压型开关稳压器,输出固定为 3.3V。器件支持宽输入电压范围 1V–5V,开关频率 1.2MHz,采用升压拓扑并集成同步整流与功率开关,静态电流仅 1µA,工作温度范围 -40℃ 至 +85℃(TA)。封装为 SOT-23-6,适合空间受限的便携式设计。

二、主要特性

  • 功能类型:升压型(Boost)
  • 输入电压范围:1V–5V,支持单节电池或多电池并联/分压场景
  • 输出电压:固定 3.3V
  • 开关频率:1.2MHz(有利于缩小外部电感与电容)
  • 同步整流:集成,降低整流损耗、提升轻载和中载效率
  • 静态电流(Iq):1µA,极低待机功耗
  • 工作温度:-40℃ ~ +85℃(TA)
  • 封装:SOT-23-6,便于小型化 PCB 布局

三、电气与热性能要点

器件通过内部功率开关与同步整流实现高转换效率,特别在中高负载下效率明显;在待机或休眠模式下,1µA 的低静态电流可显著延长电池寿命。1.2MHz 的开关频率有助于减小外部元件体积,但需注意开关损耗与 EMI 管理。热设计上,SOT-23-6 封装散热受限,建议合理布线和铜箔面积以利散热。

四、封装与 PCB 布局建议

  • 尽量将输入电容、输出电容和电感靠近芯片引脚放置,缩短信号回路面积。
  • 使用低 ESR 的陶瓷电容以减少纹波与提升瞬态响应。
  • 输入与输出的旁路电容靠近器件地端接地,地线采用大面积平面或多层回流层。
  • 注意开关节点走线短且避开敏感模拟引脚,做好 EMI 屏蔽和滤波。

五、典型应用场景

  • 电池供电的无线传感器节点、IoT 终端、可穿戴设备
  • 低功耗手持设备、便携式仪器、电量受限系统
  • 需要从低电压(如单节锂电、两节碱性)提升至稳定 3.3V 的场合

六、设计选型建议与注意事项

  • 根据工作电流选择合适的电感与电容,优先选择低 DCR、低损耗器件以提高效率。
  • 考虑开关频率与 EMI 之间的折中:1.2MHz 有利于小型化,但需验证辐射与传导干扰是否满足系统要求。
  • 在高温或高功耗场景下,验证 PCB 散热能力,必要时采取散热铜皮或散热孔。
  • 在正式设计前建议参考厂商典型应用电路与布局示意图,并做实际效率与热仿真测量。

总结:LP62610-33B6F 以超低静态电流、高度集成的同步升压架构和紧凑封装,为电池供电、空间受限且对待机功耗敏感的系统提供了实用的 3.3V 升压解决方案。

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