WMSIC Electronic Components

LOWPOWER LP6261AB6F

ModelLP6261AB6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP6261AB6F
Type
LOWPOWER
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP6261AB6F
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.064g
Electronic Component
1
Features
Load
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0229474277
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
1V~5V
Switching Frequency
1.2MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP6261AB6F 产品概述

一、产品简介

LP6261AB6F 是 LOWPOWER(微源半导体)推出的一款高集成度升压型 DC-DC 转换器,采用升压拓扑并内置开关管与同步整流功能。器件工作电压范围宽(1V~5V),适合电池供电或低压输入场景;开关频率为 1.2MHz,静态工作电流仅 1μA(Iq),在 SOT-23-6 小封装下提供单路可调输出,工作温度范围 -40℃~+85℃(TA),非常适合对尺寸、效率与待机功耗有严格要求的便携式与物联网终端产品。

二、主要特性

  • 输入电压:1.0V 至 5.0V,支持单节锂电池及更低电压电源启动与升压
  • 开关频率:1.2MHz,便于使用小体积电感与电容,减小外形尺寸
  • 低静态电流:典型 1μA,提升电池待机寿命
  • 同步整流:内置同步 MOSFET,替代肖特基二极管,降低导通损耗、提高轻载效率
  • 开关管:内置开关,简化外围设计与器件数量
  • 输出类型:可调式单路输出,灵活设置目标输出电压
  • 封装:SOT-23-6,适于空间受限的 PCB 布局
  • 工作温度:-40℃ 至 +85℃(TA),适应工业级温度需求

三、典型电气性能与设计要点

  • 升压拓扑:工作时通过开关管周期性导通/关断在电感上存储/释放能量,输出端由同步 MOSFET 进行整流与回收,提高转换效率。
  • 高频率优势:1.2MHz 的开关频率允许使用较小电感与陶瓷电容,有利于减小 BOM 体积与成本,但也对 PCB 布局与 EMI 控制提出要求。
  • 低静态电流:在待机或轻载状态下,Iq≈1μA,可显著延长电池供电设备的待机时间。
  • 可调输出:通过外部分压网络设置输出电压(请参考器件数据手册中精确的参考电压值与反馈公式),灵活适应不同负载与系统需求。

四、建议外围元件与典型应用电路(设计提示)

  • 电感 L:根据输出电流与输出电压选择,常用范围 2.2μH~10μH。为了减小占板面积并配合 1.2MHz,常选 2.2μH 或 4.7μH。要求低 DCR、较高饱和电流(大于峰值电流)。
  • 输入电容 Cin:推荐使用低 ESR 陶瓷电容(X5R/X7R),典型 10μF~22μF,置于芯片 VIN 引脚与地之间,尽量靠近芯片。
  • 输出电容 Cout:建议 10μF~47μF 的陶瓷电容以降低输出纹波与瞬态响应,必要时并联小容量以改善高频特性。
  • 反馈电阻:按 Vout = Vfb × (1 + Rtop/Rbot) 配置(Vfb 请参考资料手册),高阻值会影响噪声敏感性,过低则增加静态电流损耗。
  • 输入滤波与布局:在电源引入处增加适当去耦与入射滤波,减少开关噪声向外传播。
  • 同步整流无需肖特基二极管,简化 BOM。

示例(概念)典型条件:VIN=1.5V 升至 VOUT=3.3V,L=4.7μH,Cin=10μF,Cout=22μF。具体参数与器件型号应在实际测试与手册核对后确认。

五、PCB 布局与散热建议

  • 高频开关器件与电感、输入/输出电容应尽量靠近芯片引脚布局,缩短高 di/dt 回路环路面积以降低 EMI 与振铃。
  • 将 GND 做成连续平面,重点给功率回路留出较大铜面积以利散热与降低寄生电阻。
  • 将感性元件(电感)与敏感模拟信号隔离,避免磁耦合干扰。
  • 在高温或高功率应用场合,考虑加大铜厚或使用散热过孔,以便更好地导出热量,维持器件在额定温度范围内稳定工作。

六、典型应用场景

  • 可穿戴设备与低功耗便携终端:单节电池升压至 MCU、传感器或通信模块所需电压。
  • 物联网节点:电池供电无线传感器、遥测模块与智能传感器。
  • 工业与仪表:需要宽输入电压范围与耐温能力的低功耗升压电源。
  • 消费电子:蓝牙耳机、遥控器、智能家居小电源模块等对体积与待机功耗敏感的产品。

七、使用注意事项

  • 在选择电感、电容与布线时以实际输出电流和效率为依据,必要时在实验板上验证热、效率与稳定性。
  • 对于高 EMI 要求的系统,应配合滤波、屏蔽与 PCB 设计规范来满足标准。
  • 参考官方数据手册获取该型号的引脚定义、保护功能、精确的反馈参考电压与典型性能曲线,保证设计满足所有电气规范。

以上为 LP6261AB6F 的产品概述与实用设计建议。如需我帮您给出具体器件型号、参考电路原理图或在某一输入输出工况下的理论效率/电感选型计算,请告知目标 VIN、VOUT、最大输出电流与允许纹波等参数。

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