WMSIC Electronic Components

LOWPOWER LPA2010SMSF

ModelLPA2010SMSF
PackageMSOP-8
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LPA2010SMSF
Type
LOWPOWER
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LPA2010SMSF
Electronic Component
1
Package
MSOP-8
Electronic Component
87%
Electronic Component
Audio Power Amplifier
Electronic Component
0.185g
Electronic Component
80dB
Electronic Component
1
Power Amplifier Type
D Power Amplifier
Features
Filter; /; / Switch
Electronic Component
BM0230633639
Operating Temperature
20℃~+80℃
Operating Voltage
2.5V~5.5V
Output Power
2.8W×1@4Ω;2.3W×1@4Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPA2010SMSF 产品概述

一、主要特性

LPA2010SMSF 是微源半导体(LOWPOWER)推出的一款高效率单声道 D 类音频功率放大器。器件工作电压范围宽(2.5V~5.5V),在适当供电和负载条件下,可实现 2.8W×1(4Ω)和 2.3W×1(4Ω)的输出能力。典型总谐波失真+噪声(THD+N)仅 0.05%,信噪比 80dB,静态电流(Iq)低至 4.5mA,整机效率高达 87%,并具有 75dB 的电源纹波抑制比(PSRR)。器件封装为 MSOP-8,工作温度范围 -20℃~+80℃,输入支持单端与差分两种方式。

二、性能指标速览

  • 功放类型:D 类(高效率、低功耗)
  • 通道数:单声道
  • 输出功率:2.8W×1@4Ω;2.3W×1@4Ω(视供电与工况而定)
  • 工作电压:2.5V~5.5V
  • THD+N:0.05%(典型)
  • 静态电流:4.5mA
  • 信噪比:80dB
  • PSRR:75dB
  • 效率:87%(典型)
  • 封装:MSOP-8
  • 工作温度:-20℃~+80℃

为了评估热量:以 2.8W 输出、87% 效率计算,器件损耗约 0.42W(2.8W×(1/0.87-1)≈0.42W);以 2.3W 输出时损耗约 0.34W。静态功耗在 5V 供电时约 22.5mW(4.5mA×5V),在 3.3V 时约 14.9mW。

三、设计与布局建议

  • 电源去耦:靠近器件放置 0.1µF 至 1µF 高频去耦及 4.7µF~10µF 的稳压去耦电容,以降低电源纹波和改善 PSRR。
  • 输入处理:根据系统选单端或差分输入,差分输入可进一步抑制共模干扰并提升抗扰性。使用适当耦合电容和输入阻抗匹配。
  • 布局原则:D 类输出开关频率高,要求输出引脚到外部元件(如滤波器或扬声器)间走线短且宽;模拟地与功率地分区,公共地点回流;若需要散热,扩大 PCB 铜箔面积并考虑散热通孔。
  • 输出与扬声器:根据系统需求可采用外置 LC 滤波或直接驱动(若扬声器兼容无滤波方案),并注意 EMI 控制与布线屏蔽。

四、典型应用场景

  • 便携式蓝牙音箱、便携媒体播放器
  • 智能家电与物联网语音提示模块
  • 手持设备、便携报警器与门铃系统
  • 低功耗音频终端、玩具与可穿戴设备

五、选型与注意事项

  • 在高功率输出或高环境温度下,应评估 PCB 散热能力并适当降额使用以保证长期可靠性。
  • 若系统对超低噪声或极低失真有更高要求,可在输入与电源治理上进行加强(滤波、低噪稳压)。
  • MSOP-8 封装体积小,适合空间受限的产品设计,但需重视布板和焊接工艺以确保性能稳定。

总结:LPA2010SMSF 以低静态电流、高效率和良好音质指标为特点,适合对功耗和尺寸敏感的便携音频应用。在布局和电源管理上做足功夫,能在小体积系统中提供可靠的单声道功率放大解决方案。

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