WMSIC Electronic Components

LOWPOWER LPW5208B5F

ModelLPW5208B5F
PackageSOT-23-5
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LPW5208B5F
Type
LOWPOWER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LPW5208B5F
Electronic Component
1
Package
SOT-23-5
Type
Switch
Electronic Component
Power Electronic Switch
Electronic Component
0.047g
Electronic Component
1
Channel Count
1
Features
Integrated Charge Pump; Current
Electronic Component
BM0228552038
Resistor
160mΩ
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~6V
Current
1.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPW5208B5F 产品概述

一、产品简介

LPW5208B5F 是微源半导体(LOWPOWER)推出的一款单通道高侧开关,采用 SOT-23-5 小封装设计,面向便携和通用电源管理场合。器件支持 2.5V 至 6V 工作电压范围,输入控制为“高电平有效”,可直接驱动中低功率负载,实现对外部电源的上侧断接与保护。

二、主要特性

  • 单通道高侧开关(1 路输出)
  • 工作电压范围:2.5V ~ 6V
  • 最大连续输出电流:1.2A
  • 导通电阻(RDS(on)):典型 160 mΩ
  • 工作温度:-40℃ ~ +85℃
  • 输入控制逻辑:高电平有效
  • 集成功能:过热保护(OTP)、短路保护(SCP)
  • 封装:SOT-23-5,适用于空间受限的 PCB 设计

三、电气与热特性摘要

  • 额定最大连续电流 1.2A,适合中等电流负载(如小型电机驱动除外、或需额外热设计)
  • 导通电阻 160 mΩ 在额定电压与温度下可提供较好的功率效率,但在高电流或高环境温度下需关注功耗与结温上升
  • 工作温度范围覆盖工业级常用范围,-40℃ 至 +85℃,适合多数商业与工业应用环境

四、典型应用场景

  • 便携式设备电源管理(电池供电模块的电源开关)
  • 外围电源控制(摄像头、传感器、无线模块等)
  • LED 分路开关与保护(单通道弱电负载)
  • 工业控制中的电源保护与切换

五、保护行为与注意事项

  • 器件集成过热保护与短路保护:当发生短路或器件过热时,LPW5208B5F 会进入保护状态以防止损坏。具体的触发阈值、限流行为与复位方式请参阅产品数据手册。
  • 热管理:在接近 1.2A 时,器件功耗显著增加,应通过 PCB 大面积铜箔、散热过孔或降低占空比来降低结温。
  • 负载类型:对感性负载(继电器线圈、马达)或有反向尖峰的应用,建议在输入端/输出端添加 TVS、二极管或缓冲网络以抑制瞬态过压。

六、使用与 PCB 布局建议

  • 在 VIN 近源端放置适当的去耦电容(如 1µF~10µF),以保证瞬态响应和稳定性。
  • 将开关的电流路径(VIN、VOUT、GND)设计为宽的铜迹或加铜铺地,以降低寄生电阻和热阻。
  • SOT-23-5 封装建议配合器件厂商提供的 PCB 焊盘模板与焊接工艺,确保焊点可靠性与热性能。
  • 控制端 IN 应充分隔离噪声源,避免误触发;如长线控制可加 RC 滤波或缓冲驱动。

七、封装与采购信息

  • 品牌:LOWPOWER(微源半导体)
  • 型号:LPW5208B5F
  • 封装:SOT-23-5
  • 推荐查看厂商正式数据手册以获取引脚定义、典型特性曲线、保护阈值与封装详细尺寸信息;采购时请通过正规分销商或厂商授权渠道确认包装方式(卷带/Reel 等)与标识。

备注:本文概述基于器件关键参数与通用工程实践,具体设计实现应以 LPW5208B5F 官方数据手册及应用笔记为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.