WMSIC Electronic Components

LOWPOWER LP28057ASPF

ModelLP28057ASPF
PackageESOP-8
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP28057ASPF
Type
LOWPOWER
Minimum package
4000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP28057ASPF
Electronic Component
1
Package
ESOP-8
Electronic Component
Battery Management
Electronic Component
0.183g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0229474297
Operating Temperature
20℃~+85℃
Operating Voltage
4.5V~6.5V
Battery Type
Battery
Battery
1
ICType
IC
Static Current(Iq)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP28057ASPF 产品概述

一、产品简介

LP28057ASPF 是 LOWPOWER(微源半导体)面向单节锂离子电池的充电管理芯片,封装为 ESOP-8。芯片输入工作电压范围为 4.5V ~ 6.5V,最大充电电流可达 1A,充电饱和电压(终止电压)为 4.2V。器件支持电池温度检测功能,适用于需要精确温度保护和低静态电流的便携设备与智能终端。工作温度范围 -20℃ ~ +85℃,静态电流仅 1μA,适合要求长待机和低漏电的应用场合。

二、主要特性

  • 适配单节锂电池(Li-ion),充电策略为恒流/恒压(CC/CV)模式,实现快速充电与安全终止。
  • 输入电压范围宽(4.5V~6.5V),可直接配合常见 USB/适配器 5V 电源使用。
  • 最大充电电流 1A,满足中小功率便携终端和消费类电子的充电需求。
  • 充电饱和电压 4.2V,兼容标准锂电池规格。
  • 支持电池温度检测(NTC 接入),对低温/高温状态进行充电抑制或停充保护。
  • 超低静态电流 Iq = 1μA,有利于电池断开时减少自放电和系统待机功耗。
  • 工业级工作温度(-20℃~+85℃),可靠性高,适合较宽温度场景。
  • ESOP-8 封装,便于 PCB 布局与散热处理。

三、典型应用场景

  • 便携式消费类电子:蓝牙音箱、便携播放器、小型摄像设备等;
  • 智能家居与物联网终端:传感器、无线网关、智能遥控器等;
  • 便携测量与医疗设备:手持检测仪器、便携式医疗监护设备(需遵循医用安全规范);
  • 电池管理或充电模块集成方案,作为单节锂电充电前端控制芯片。

四、外部器件与设计注意事项

  • 充电电流设置:典型通过外接编程电阻或电流检测电阻设定最大充电电流(示例 1A),请按芯片数据手册计算并选择阻值。
  • 散热设计:线性或开关充电拓扑下,最大功耗由 Vin 与电池电压差乘以充电电流决定,举例 Vin=6.5V、VBAT=4.2V、I=1A 时,芯片需耗散约 2.3W,需通过 PCB 铜箔、散热垫或外部散热器进行热管理,或降低输入电压/充电电流以控制发热。
  • 温度检测:使用标准 NTC 温度传感器连接至温度检测引脚,实现过冷/过热保护与恢复阈值监控,阈值和分压网络按参考应用电路设计。
  • 输入/输出去耦与布局:靠近芯片放置足够的输入电容和输出电容,合理布局电流回流路径;电流检测元件(若有)应尽量靠近芯片和电源引脚,接地采用单点或连续地平面以降低噪声。
  • 保护与指示:建议在输入侧加入反向保护二极管、保险丝与 TVS,以增强系统鲁棒性;可外接指示 LED 反映充电状态(需查询引脚功能)。

五、封装与可靠性

ESOP-8 封装兼顾封装密度与散热性能,布板时注意暴露焊盘或增加散热铜箔以提升热流散能力。器件工业级温度范围使其适合多种环境应用,但在高温或高功率工作点应做热仿真与可靠性验证。

六、选型建议

  • 若系统电源为 USB(5V)且最大充电电流 ≤1A,LP28057ASPF 是直接且经济的选择;
  • 对于对发热敏感的便携设备,建议将充电电流设置为小于 1A 或采用降压充电拓扑以降低芯片热耗散;
  • 需要完整保护特性(如过流、定时终止、完整状态指示)的项目,请参照官方数据手册与参考设计,结合外部保护元件实现系统级安全。

如需原理图参考、典型应用电路或完整电气规格(引脚定义、时序、编程方法等),建议下载 LOWPOWER 官方数据手册或联系厂家技术支持获取详细资料与评估板。

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