WMSIC Electronic Components

LOWPOWER LP3980AB5F

ModelLP3980AB5F
PackageSOT-23-5
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP3980AB5F
Type
LOWPOWER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
100uVrms
Electronic Component
LP3980AB5F
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.041g
Electronic Component
1
Features
Output
Electronic Component
BM0238754013
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
800mV~5.5V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP3980AB5F 产品概述

一、简介

LP3980AB5F 是 LOWPOWER(微源半导体)推出的一款高性能低压差线性稳压器(LDO),采用 SOT-23-5 小封装,面向对功耗、噪声和电源抑制有严格要求的便携与嵌入式应用。器件支持可调输出(0.8V~5.5V),最大输出电流可达 300mA,静态电流仅 20µA,适合电池供电或待机功耗敏感的系统。

二、主要参数与特性

  • 输出类型:可调(0.8V ~ 5.5V)
  • 最大工作电压(Vin):5.5V
  • 最大输出电流:300mA
  • PSRR:76dB @ 1kHz(优异的电源纹波抑制能力)
  • 噪声:100µVrms(低噪声,适合模拟前端与音频电路)
  • 静态电流(Iq):20µA(超低静态电流,适合低功耗应用)
  • 保护功能:过流保护、过热保护
  • 控制:带使能(EN)功能,便于系统唤醒/睡眠管理
  • 工作温度:-40℃ ~ +85℃(Ta)
  • 输出极性:正极
  • 通道数:单通道
  • 封装:SOT-23-5

三、应用场景

  • 电池供电的便携设备(手持终端、可穿戴设备)
  • 物联网节点与低功耗传感器
  • 模拟电路与传感器前端(得益于低噪声与高 PSRR)
  • 摄像头模组和音频前端电源
  • MCU、FPGA 的局部稳压与基准供电

四、电路设计与外围元件建议

  • 输入/输出电容:为保证稳压器稳定与滤噪,推荐使用 1µF ~ 10µF 的 X7R 陶瓷电容,且电容应靠近 VIN、VOUT 引脚放置。低 ESR 有利于瞬态响应与稳定性。
  • 可调电路:通过外部电阻分压设定输出电压,建议分压阻值总和在几 kΩ 到几十 kΩ 范围,避免过低增加待机损耗或过高引入噪声敏感性。
  • 使能引脚:EN 引脚可直接由 MCU 或外部控制信号驱动,低电平关闭器件以实现低功耗;设计时注意 EN 的输入电平阈值及上拉/下拉策略。
  • 保护与滤波:若输入源有较大瞬变或反向注入,建议加入输入滤波或瞬态抑制元件(如 TVS 二极管、串联阻抗)以提高鲁棒性。

五、热设计与应用限额

线性稳压器的功耗为 Pd = (Vin - Vout) × Iout。SOT-23-5 封装散热能力有限,当 Vin 与 Vout 相差较大且输出电流靠近 300mA 时,芯片内部温升明显,可能触发热关断或影响可靠性。设计时应:

  • 尽量减小 Vin - Vout,或在高电流工况下采用降压预稳压器;
  • 在 PCB 上使用较大铜箔面积并考虑热过孔以增强散热;
  • 对连续大电流工况进行热仿真与实测验证,确保器件在目标环境下工作安全。

六、封装与引脚功能(典型)

SOT-23-5 紧凑封装,典型引脚包含 VIN、VOUT、GND、EN(使能)、ADJ(调节)。实际封装引脚排列请参照官方数据手册以获取准确的引脚图与尺寸信息。

七、总结

LP3980AB5F 以极低静态电流、良好 PSRR 与低噪声为主要卖点,适合电池供电和对电源质量敏感的应用。通过合理的外围元件选择与 PCB 热设计,可以在小体积封装下实现稳定、低噪的电源输出。有关精确的引脚分配、外部元件典型值和性能曲线,请以微源半导体官方数据手册为准。

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