WMSIC Electronic Components

LOWPOWER LP6216B6F

ModelLP6216B6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP6216B6F
Type
LOWPOWER
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP6216B6F
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.065g
Electronic Component
1
Type
Electronic Component
Electronic Component
BM0228977522
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
2.5V~24V
Switching Frequency
1MHz
Electronic Component
Electronic Component
Output Voltage
2.5V~24V
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP6216B6F 升压型DC-DC转换器产品概述

一、产品简介

LP6216B6F 是微源半导体(LOWPOWER)推出的一款高集成度升压型DC-DC稳压器,采用升压拓扑并内置开关管,面向对体积与效率有较高要求的便携式与工业电源应用。器件工作电压范围宽(2.5V24V),输出可调(2.5V24V),最大输出电流可达3A,开关频率为1MHz,静态电流仅350μA,工作温度范围为-40℃至+85℃(TA)。封装为常用的SOT-23-6,便于小体积设计与批量贴片生产。

二、主要规格一览

  • 功能类型:升压(Boost)
  • 输入电压范围:2.5V ~ 24V
  • 输出电压范围:2.5V ~ 24V(可调)
  • 最大输出电流:3A
  • 开关频率:1MHz
  • 静态电流(Iq):350μA
  • 工作温度:-40℃ ~ +85℃(TA)
  • 输出通道数:1(单通道)
  • 拓扑结构:升压式
  • 开关管:内部集成
  • 输出类型:可调
  • 封装:SOT-23-6
  • 品牌:LOWPOWER(微源半导体)

三、关键特性与产品优势

  • 宽输入与输出电压范围:支持从低压电池到高电压输入,适应性强,可用于多种电源环境。
  • 高集成度:内部集成功率开关管,减少外部器件数量,简化系统设计与BOM成本。
  • 高频开关(1MHz):允许使用小体积电感与陶瓷电容,整体方案尺寸小,适合空间受限的设备。
  • 低静态电流:350μA的待机电流有利于电池供电系统延长待机时间。
  • 大输出电流能力:最高3A输出能力可驱动功率较高的负载或为后段稳压/负载供能。
  • 可靠的工作温度范围:-40℃至+85℃适合消费类与工业级应用场景。

(注:具体保护功能和细节参数请以官方数据手册为准,典型器件通常具备软启动、过流保护、过温保护与使能引脚等便利功能。)

四、典型应用场景

  • 便携式设备:手持仪器、便携式医疗设备、移动通信终端的升压供电。
  • 汽车与车载电子(符合工作温度与输入电压范围时):车内小功率升压模块。
  • 工业控制与传感节点:需要从低电压来源生成稳定高压供电的传感器、数据采集模块。
  • LED驱动与动力子系统:中小功率LED背光或驱动应用(需根据功率与恒流方案调整)。
  • 电源管理子模块:作为多电压系统的升压子系统,为后段DC-DC或模拟电路提供电源。

五、典型外部元件选择与注意事项

  • 电感(L):1MHz工作频率下常用小体积功率电感,典型范围根据应用电流与纹波要求可选4.7µH~22µH;对3A输出应选用饱和电流高于工作峰值的器件。
  • 输入/输出电容:建议使用低ESR陶瓷电容(X5R/X7R),输入端10µF以上,输出端22µF~100µF,根据纹波与瞬态响应调整容量与并联电容。
  • 敲击二极管/整流元件:若设计为非同步升压,需选用快速恢复或肖特基二极管;若芯片带有同步整流,请参考手册是否可省略外部二极管。
  • 反馈网络:外接电阻分压设置输出电压,注意FB引脚电流与误差放大器限制,使用高精度电阻可提高输出精度。
  • 使能(EN)与软启动:可通过外部使能引脚控制开/关;若需要限制启动浪涌,建议外接软启动电容或使用限流元件。

六、PCB布局与热设计建议

  • 输入电容与芯片VIN脚尽可能靠近,输出电容与FB、SW节点靠近布局,以减小回路面积与寄生感抗。
  • 连接开关节点(SW/LX)、二极管与电感的走线要短而粗,以降低开关损耗与EMI。
  • 垫大铜面积(尤其是地与散热垫)并在需要位置加热盲/通孔,利于热量散出,保障在高输出电流时稳定工作。
  • 使用多点接地与星形地回路避免噪声耦合到敏感模拟电路。

七、封装与订购建议

LP6216B6F 采用SOT-23-6小外形封装,适合贴片生产与自动化焊接。选型时请依据负载电流、热设计和系统要求确认是否满足良好的散热条件与电流裕量。正式设计与量产前,建议索取并细阅LP6216B6F官方数据手册,进行仿真与样机验证,确认外部器件取值与EMI/稳定性指标。

如需进一步的典型应用电路、PCB参考布局或器件替代建议,可提供具体输入/输出电压与负载条件,我将给出更针对性的设计指导。

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