Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM033R61C105ME15D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM033R61C105ME15D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM033R61C105ME15D
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0229917376
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM033R61C105ME15D 产品概述
一、主要参数与标识
GRM033R61C105ME15D 是村田（muRata）生产的一款多层陶瓷贴片电容（MLCC）。基础参数如下：电容值 1.0 μF，额定电压 16 V，容差 ±20%，介质材料 X5R，封装 0201。常用描述为“贴片电容(MLCC) 16V ±20% 1uF X5R（村田，0201）”。
二、性能与特点
- X5R 介质在-55°C 至 +85°C 范围内具有相对稳定的介电特性，适合通用旁路与退耦用途。
- 0201 超小封装适合空间受限的移动设备、可穿戴与小型模块，但单位体积的电容量较小，制造与贴装对精密度要求高。
- MLCC 本身具有低等效串联电阻（ESR）和低等效串联电感（ESL），适合高频去耦和瞬态响应要求高的电源线路。
- 需注意直流偏置效应：在接近额定电压的工作条件下，实际电容值可能下降，设计时应预留裕量。
三、典型应用场景
适用于移动终端、无线模块、蓝牙/射频前端、电源旁路、去耦、去耦群（decoupling array）、滤波器件等对体积和高频性能有严格要求的场合。也常用于消费电子、物联网终端与微型化电源设计。
四、封装与装配注意事项
0201 尺寸对贴片机和回流工艺要求高，推荐采用精确的点胶/回流工艺与自动识别的贴装设备。遵循村田的回流焊曲线和湿敏包装（MSL）说明，必要时在回流前进行烘烤以防吸湿起泡。手工焊接与波峰焊并不推荐。
五、设计提示与可靠性注意
- 在电源去耦设计中，考虑直流偏置与温度对电容的影响，可并联多个不同容值或介质类型以优化频率响应与有效电容。
- 0201 的机械强度有限，板上应避免过大的机械应力与不当的丝印或紧固件压迫。
- 对于关键或严苛环境，请参考厂方完整数据手册以确认温度循环、振动与寿命试验数据。
六、替代与采购建议
选型时可参考同等参数的其他品牌 MLCC 作为备选，但注意比较直流偏置曲线、介质等级与封装尺寸的一致性。采购时确认完整料号、包装形式与出厂检测记录，避免低成本来源带来质量风险。若用于汽车或高可靠性场合，务必选用经过相应认证的件型。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
