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muRata BLM03PX121SN1D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata BLM03PX121SN1D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- BLM03PX121SN1D
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0227340212
- Operating Temperature
- 55℃~+125℃
- Current
- 700mA
- @Frequency
- 120Ω@100MHz
- Resistor(DCR)
- 160mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BLM03PX121SN1D 产品概述
一、产品简介
BLM03PX121SN1D 为村田（muRata）生产的单通道0201封装金属氧化物磁珠（ferrite bead）。在100MHz 时阻抗为120Ω，阻抗公差±25%；典型直流电阻（DCR）约160mΩ；额定直流电流700mA；工作温度范围为-55℃至+125℃。该器件体积极小，适合高密度表贴电路板的电磁干扰（EMI）抑制与电源去耦应用。
二、关键电气参数
- 阻抗：120Ω @ 100MHz（±25%）
- 直流电阻（DCR）：约160mΩ
- 额定电流：700mA（连续通流能力）
- 通道数：1（单线结构）
- 温度范围：-55℃～+125℃
注：磁珠为电流依赖型元件，随直流偏置或温度变化阻抗会下降，实际电路中应参考厂方的阻抗-电流特性曲线。
三、主要功能与应用场景
BLM03PX121SN1D 主要用于：
- 电源线与信号线的高频噪声抑制（尤其在几十到几百MHz范围内有效）
- 手机、便携式设备、IoT模块、摄像头模组、电源管理线路的EMI控制
- 在需要小尺寸与中等电流能力（~700mA）的高密度PCB上作为串联滤波或多段滤波器件
四、封装与装配建议
- 封装：0201（典型尺寸约0.6×0.3 mm），适配高密度贴装与自动化贴片工艺
- 焊接：建议采用厂家推荐的回流焊工艺曲线，避免超温或长时间高温导致性能退化
- 布局：器件应尽量贴近噪声源或敏感器件端口串联放置，靠近IC电源引脚或输入端以提高滤波效率；两端走线短且宽，减少寄生感/电阻
- 测试：在设计阶段验证阻抗随直流电流的衰减，确认在700mA工作点仍有足够抑制效果
五、可靠性与注意事项
- 温度与电流同时作用下，阻抗会下降，应按实际工况进行裕量选择
- 0201体积小，抗机械应力能力相对有限，避免强力弯折或机械冲击
- 储运与回流焊需遵循村田的湿热及回流规范，防止焊接缺陷
六、选型建议与替代
在选型时关注：目标频段的阻抗值、工作电流下的阻抗保持、DCR 对压降的影响以及封装与工艺兼容性。若需更高电流或更高阻抗，可考虑村田其他系列（如BLM15/BLM18等）或其他厂商等效品，确保对比阻抗曲线与封装尺寸。
七、总结
BLM03PX121SN1D 以其120Ω@100MHz 的中高频抑制能力、低DCR和微小0201封装，适合于对板上空间和电流有一定要求的EMI抑制场合。设计时应结合阻抗随电流/温度的特性曲线进行验证，合理布线与焊接可发挥最佳滤波效果。若需更详细的特性曲线、封装尺寸与焊接条件，请参考村田官方数据手册。
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