WMSIC Electronic Components

muRata GRM155Z71A225KE01D

ModelGRM155Z71A225KE01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155Z71A225KE01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155Z71A225KE01D
Electronic Component
1
Electronic Component
2.2uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0095505464
Electronic Component
X7R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM155Z71A225KE01D

产品简介 GRM155Z71A225KE01D 是由Murata Electronics制造的一款高性能多层陶瓷电容器(MLCC),属于GRM系列。该电容器具有2.2 µF的电容量,工作电压额定为10V,具备X7R的温度系数,适用于多种通用电子应用。

基本参数

  • 制造商: Murata Electronics
  • 系列: GRM
  • 零件状态: 在售
  • 电容: 2.2 µF
  • 容差: ±10%
  • 电压 - 额定: 10V
  • 温度系数: X7R
  • 工作温度: -55°C ~ 125°C
  • 应用: 通用
  • 安装类型: 表面贴装
  • 封装/外壳: 0402(1005 公制)
  • 尺寸: 0.039" 长 x 0.020" 宽(1.00mm x 0.50mm)
  • 厚度(最大值): 0.026"(0.65mm)

详细特性

  1. 电容量与耐压: GRM155Z71A225KE01D的电容值为2.2 µF,这一电容值在各种电子电路中具有广泛的应用,能够为电源去耦、信号耦合和滤波等功能提供良好的支持。此外,其10V的耐压使得该组件在大多数中低压电路中表现出色,能有效降低由过电压引起的失效风险。

  2. 温度系数X7R: 该电容器采用X7R温度系数,意味着其电容值在-55°C至125°C的温度范围内变化非常小,通常不超过±15%。这种特性使得GRM155Z71A225KE01D非常适用于需要在极端温度下工作的环境,保证了电路的稳定性和可靠性。

  3. 尺寸与封装: 本产品采用0402封装(1005公制),体积非常小巧(1.00mm x 0.50mm),且厚度仅为0.65mm。这使得该铝电容器非常适合安装在空间受限的电路板上,尤其是在智能手机、可穿戴设备等小型电子产品中表现尤为突出。

  4. 表面贴装技术: 由于采用表面贴装(SMT)技术,GRM155Z71A225KE01D便于在自动化生产过程中进行快速贴装和焊接,从而提高了生产效率并降低了人工制造成本。

  5. 广泛应用: 这款电容器广泛应用于消费电子、通信设备、工业控制、仪器仪表等领域。在消费电子产品中,它可以用于滤波、电源去耦和信号耦合,确保电路的电源平稳和信号质量。

应用场景

  • 智能手机: 在手机主板中充当去耦电容,帮助稳定电源,并过滤高频噪声,提高音频和视频信号的质量。
  • 可穿戴设备: 由于其小巧的尺寸,适合用于智能手表、健康监测设备等可穿戴电子产品中。
  • 家用电器: 可以用于洗衣机等家用电器的控制模块中,确保电源的平稳输出。
  • 通信设备: 在基站及其他通信设备中,对信号进行耦合和去耦,提高数据传输的稳定性与可靠性。

结论 GRM155Z71A225KE01D是一款高品质、高性能的多层陶瓷电容器,凭借其优越的电气特性、紧凑的尺寸和可靠的工作性能,在现代电子产品中得到了广泛应用。其出色的温度特性和适用性使其不仅适合工业和消费电子领域,同时也满足了严苛环境下的应用需求,是工程师在设计电路时的一款理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.