Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述:GRM188R61A106KE69D
基本信息:
GRM188R61A106KE69D是由知名电子元件制造商muRata(村田)生产的一款表面贴装多层陶瓷电容器(MLCC)。该电容器具有丰富的应用特性和良好的性能表现,广泛适用于各种电子电路中。其主要技术参数包括额定电压10V、容量10µF、温度范围-55°C至85°C、以及介质材料采用X5R,在实际使用中具备良好的电气特性和可靠性。
电气特性:
容值与容差:GRM188R61A106KE69D的额定电容量为10µF,容差为±10%。这一特性保证了在电路设计中,能够满足特定的电容需求,而不必过于担心实际值的偏差。
额定电压:该电容器的最大额定电压为10V。适合大多数低电压应用,例如消费电子产品和各类数字电路。
温度系数与温漂:作为使用X5R介质材料的电容器,GRM188R61A106KE69D说明在-55°C到85°C的工作温度条件下,电容的温度稳定性较好,适合于温度变化较大的环境中使用。同时,X5R具有良好的温度特性,使其在电压及温度波动下有较小的电容量变化。
物理特性:
封装类型与尺寸:GRM188R61A106KE69D采用0603(1608公制)封装,这种紧凑的设计使其在现代电子设备中非常受欢迎。具体尺寸为1.60mm x 0.80mm x 0.95mm(长x宽x厚),便于在小型电路板上进行高密度布线。
安装方式:该电容器为表面贴装(SMD),适合自动化贴片生产,方便集成到各类电路板中。
应用范围:
GRM188R61A106KE69D具有通用性,可广泛应用于多个领域,包括但不限于:
消费电子:如手机、平板电脑、儿童玩具等小型电子产品中,提供平滑的电源供应和去耦功能。
网络与通信设备:在路由器、交换机等网络设备中,用于电源滤波和去耦,以确保信号稳定传输。
工业设备:能在高低温环境下稳定工作,适合一些特殊环境条件的工业电路设计。
汽车电子:由于其宽广的温度适应性,非常适合用于汽车内部的控制单元和传感器电路。
总结:
GRM188R61A106KE69D是muRata厂商推出的一款性价比高、性能稳定的表面贴装多层陶瓷电容器,凭借其10µF的容值、±10%的容差以及-55°C到85°C的工作温度范围,极为适合现代电子产品的设计需求。其0603封装设计使得电路板的组装更加方便快捷,特别是在高密度的应用场景中,其性能优势更为明显。随着电子产品向小型化和高功能化趋势发展,GRM188R61A106KE69D无疑是信赖度高的选择,适合在各种电子产品中实现电源管理和信号去耦等功能。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products