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muRata GRM033R61E334KE15D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- mu Rata GRM033R61E334KE15D
- Type
- MURATA
- Minimum package
- 15000
Technical parameters
- Electronic Component
- MURATA
- Electronic Component
- GRM033R61E334KE15D
- Electronic Component
- 1
- Electronic Component
- 330nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0257270918
- Voltage
- 25V
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM033R61E334KE15D 产品概述
一、产品简介
GRM033R61E334KE15D 为村田（muRata）出品的贴片多层陶瓷电容（MLCC），额定参数为 330 nF（0.33 μF）、容差 ±10%、额定电压 25 V，采用 0201 超小型封装。该器件适合对体积和布局密度要求较高的现代电子产品，用于旁路、去耦、滤波与耦合等电路。
二、主要参数
- 容值：330 nF（0.33 μF）
- 容差：±10%
- 额定电压：25 V
- 封装：0201（超小型贴片）
- 类型：多层陶瓷电容（MLCC）
（注：陶瓷电容在实际工作电压和温度下可能出现直流偏置和温度系数引起的容量变化，请在设计时考虑）
三、主要特性与优势
- 体积极小，便于高密度布板和多层 PCB 设计。
- MLCC 固有的低等效串联电阻（ESR）和低等效串联电感（ESL），在高频去耦和瞬态响应上表现良好。
- 良好的可靠性和长期稳定性，适合消费电子、移动设备与便携式终端等领域。
- 标准化生产，适配 SMT 自动化装贴，提升产线效率。
四、典型应用场景
- 电源旁路与去耦（CPU、PMIC、射频模块等）。
- 高频滤波与阻尼网络。
- 信号耦合/去耦、阻抗匹配中的补偿元件。
- 空间受限的消费电子、移动终端、可穿戴设备与小型传感器节点。
五、封装与布局注意事项
- 0201 尺寸极小，装配时建议使用精密取放设备和优化的吸嘴以降低失贴/倒料风险。
- 靠近电源引脚放置以缩短回流路径，使用短粗的走线和单点接地策略以提升去耦效果。
- 对于高电压或对容量要求严格的场合，考虑并联多个电容以减少直流偏置影响并提高总容量与频率响应。
- 避免在 PCB 弯曲处或强应力区域焊接，以防裂纹导致失效。
六、焊接与可靠性建议
- 支持标准回流焊工艺，遵循元件与PCB制造商推荐的回流曲线（一般峰值温度不超过器件耐受值）。
- 小尺寸元件易受热应力和机械应力影响，焊盘设计与焊膏量需优化以保证焊接强度与电气可靠性。
- 生产与使用环境应避免过度潮湿与剧烈温度循环，以降低失效风险。
七、选型提示与替代方案
- 若对温度稳定性或容量随偏压变化敏感，可在选型时关注陶瓷介质（如 X7R/X5R/NPO）的特性，或考虑串并联组合以满足性能需求。
- 对更高工作电压或更低漏电的应用，可选择同系列不同额定电压或更大封装的型号以获得更稳定的实测容量。
总结：GRM033R61E334KE15D 以其 330 nF/25 V 的参数和 0201 超小封装，适合对空间与性能均有严格要求的电子产品，合理的 PCB 布局与装配工艺可充分发挥其在瞬态抑制与高频去耦方面的优势。若需更详细的电气特性曲线或封装尺寸图，建议参考村田官方产品数据手册。
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