WMSIC Electronic Components

muRata GCM1555C1H200FA16D

ModelGCM1555C1H200FA16D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GCM1555C1H200FA16D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GCM1555C1H200FA16D
Electronic Component
1
Electronic Component
20pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±1%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0259364734
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GCM1555C1H200FA16D 多层陶瓷电容器(MLCC)产品概述

一、产品核心身份标识

  • 品牌:muRata(村田制作所)——全球领先的电子元器件制造商,MLCC技术积累深厚
  • 产品类型:多层陶瓷电容器(MLCC)
  • 型号:GCM1555C1H200FA16D
  • 封装规格:0402(英寸,对应公制尺寸0.4mm×0.2mm,村田封装代码为「1555」)
  • 关键认证:AEC-Q200(汽车电子可靠性标准认证,满足汽车级环境测试要求)

二、性能参数深度解析

1. 容值与精度

标称容值为20pF,精度达**±1%**——这是MLCC中较高的精度等级,相比常见的X7R材质(精度±5%/±10%),更适合对容值一致性要求严格的场景(如射频谐振电路、精密滤波网络),可减少电路参数偏差导致的信号失真。

2. 额定电压与安全裕量

额定电压为50V(村田电压代码「1H」),覆盖绝大多数低压电子系统的需求(3.3V、5V、12V、24V等),留有充足安全裕量,避免长期工作时的电压击穿风险,同时适配汽车12V/24V供电系统的常规电压波动。

3. 温度特性(C0G材质核心优势)

采用C0G陶瓷材质(又称NP0),温度系数为±30ppm/℃,工作温度范围覆盖**-55℃至125℃**——容值随温度变化极小,是高频、精密电路的核心保障:

  • 汽车传感器在极端温度(冬季-40℃、夏季引擎舱120℃)下仍能保持稳定滤波性能;
  • 射频电路不会因温度波动导致频率偏移,避免信号质量下降。

4. 封装与焊接可靠性

0402小型化封装适配高密度PCB设计(如智能手机主板、汽车ECU控制板),村田的封装工艺确保焊接可靠性(低焊盘脱落风险),同时兼容主流回流焊/波峰焊工艺。

三、典型应用场景

1. 汽车电子领域(AEC-Q200核心适配)

  • 车载传感器:胎压监测、摄像头、毫米波雷达的信号滤波;
  • ADAS系统:高级驾驶辅助控制器的高频耦合;
  • 车载电子:车机、仪表盘的电源滤波,适应汽车环境的温度循环、振动测试要求。

2. 通信与射频设备

  • 5G基站、路由器、交换机的射频前端(滤波器、谐振器);
  • 无线模块(Wi-Fi 6、蓝牙5.3)的信号匹配,利用C0G低损耗特性减少信号衰减。

3. 工业与消费电子

  • 工业控制:PLC、伺服驱动器的信号滤波(稳定±1%精度);
  • 高端消费电子:智能手机、平板的射频电路(0402封装适配紧凑主板);
  • 医疗设备:便携式监护仪的精密电路(低干扰、稳定温度特性)。

四、产品竞争优势

  1. 高精度+高稳定性:C0G材质+±1%精度,解决普通MLCC(如X7R)容值随温度/电压漂移的问题,适合精密电路;
  2. 汽车级可靠性:AEC-Q200认证通过汽车行业严苛测试(温度循环-40~125℃、振动10G),长期故障率低;
  3. 村田工艺优势:多层陶瓷叠层工艺成熟,一致性好,低ESR(等效串联电阻)、低ESL(等效串联电感),提升高频性能;
  4. 适配性广:50V额定电压覆盖多数低压场景,0402封装兼容主流PCB设计。

五、选型与使用注意事项

  • 电压限制:电路工作电压(含峰值纹波)不得超过50V;
  • 温度范围:确认工作环境温度在-55~125℃内(汽车引擎舱、工业高温环境需验证);
  • 精度匹配:若需求精度低于±1%,可考虑同系列低精度型号降低成本;
  • 焊接工艺:0402封装需遵循村田推荐的回流焊温度曲线,避免虚焊。

该型号是村田针对汽车电子、高频通信等领域推出的高可靠性MLCC,凭借C0G材质的稳定特性、AEC-Q200认证及小型化封装,成为精密电路设计的优选方案。

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