Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品基础信息
产品概述 GRM2165C1H472JA01D是一款高性能多层陶瓷电容器,具有4700pF的电容值以及±5%的容差,为电路设计提供了精确和稳定的电容性能。凭借其额定电压为50V,这款电容器能够满足大多数电子设备的要求,尤其适合高频应用和严苛环境条件下的使用。
构造与材料 此电容器采用高品质陶瓷材料制成,特别是C0G/NP0温度系数,这使得电容器在整个工作温度范围内表现出极佳的稳定性和低的温度漂移。该特性令其在高频和高温环境中仍能保持可靠的电气性能,广泛应用于滤波、耦合、旁路和谐振电路等关键场合。
设计与封装 0805封装(2012公制)设计使得GRM2165C1H472JA01D适合于表面贴装技术(SMT),其紧凑的尺寸(2.00mm x 1.25mm)不仅节省了印刷电路板(PCB)空间,还提高了整体的装配密度。这种小型封装使得设计工程师能够在有限的空间内集成更多功能,满足现代电子产品日益追求的小型化趋势。
应用领域 由于其优异的电气特性和强大的环境适应性,该电容器广泛应用于各种电子设备中,包括:
性能优势 GRM2165C1H472JA01D具有多项显著优势:
总结 GRM2165C1H472JA01D多层陶瓷电容器是当今高端电子设备中不可或缺的元件之一。它将高性能、稳定性和小型化有效结合,为众多电子应用提供了强有力的支持。选择村田的这款电容器,无疑是确保产品质量和性能的一项明智投资。无论是研发阶段还是大规模生产,该产品都能为工程师提供最佳的解决方案,全面满足现代电子技术的发展需求。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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