WMSIC Electronic Components

muRata LQP03HQ2N4B02D

ModelLQP03HQ2N4B02D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata LQP03HQ2N4B02D
Type
MURATA
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQP03HQ2N4B02D
Electronic Component
1
Package
0201
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.008g
Inductor
2.4nH
Electronic Component
1
Factor
20@500MHz
Electronic Component
BM0259012916
Current
600mA
Frequency
9GHz
Resistor(DCR)
120mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQP03HQ2N4B02D 贴片厚膜电感产品概述

一、产品基本身份信息

LQP03HQ2N4B02D是村田(muRata) 推出的贴片厚膜电感,型号命名中「2N4」直接对应核心电感值2.4nH,采用0201封装(英制尺寸0.02×0.01英寸,公制0.64×0.32mm),定位为高频小功率电子设备的核心阻抗匹配/滤波元件,广泛适配射频、高速数字等场景。

二、核心电气性能参数

该电感针对高频应用优化,关键参数如下:

  • 电感值:2.4nH(低电感值适配射频链路的阻抗匹配、信号滤波,避免高频下感抗过大影响信号传输);
  • 额定电流:600mA(直流/交流额定电流,确保工作时电感未达饱和状态,温升控制在安全范围);
  • 直流电阻(DCR):120mΩ(低DCR显著减少功率损耗,提升便携设备电池续航能力);
  • 品质因数(Q值):20@500MHz(Q值为储能与损耗比值,20在500MHz频段表现优异,降低射频信号衰减);
  • 自谐振频率(SRF):9GHz(远高于主流射频频段(2.4G/5G),避免工作频段内谐振干扰,拓宽有效带宽)。

三、封装与物理特性

  1. 0201小型化封装:尺寸仅0.64×0.32mm,适配高密度PCB布局,满足智能手表、无线耳机等小型设备的miniaturization需求;
  2. 厚膜工艺优势:采用陶瓷基厚膜技术,电感参数一致性高(量产良率稳定),耐温范围宽(-55℃~+125℃),抗振动、耐湿性能优异;
  3. 低损耗载体:陶瓷基封装材料高频损耗低,进一步保障射频性能。

四、典型应用场景

结合性能参数,该电感主要应用于:

  1. 射频前端模块:手机、平板的WiFi(2.4G/5G)、蓝牙(2.4G)电路的阻抗匹配、滤波,提升信号传输质量;
  2. IoT无线终端:低功耗蓝牙(BLE)、ZigBee设备的射频链路,满足小电流、高频段工作需求;
  3. 高速数字电路:DDR内存周边、USB 3.0/Type-C等高速接口的去耦、滤波,抑制电磁干扰(EMI);
  4. 便携电子设备:智能手表、无线耳机、智能手环等尺寸敏感产品,利用0201封装实现紧凑设计。

五、产品优势与价值

  1. 高频性能突出:Q值20@500MHz、SRF达9GHz,覆盖主流射频频段,谐振干扰小,信号损耗低;
  2. 低损耗高效能:120mΩ低DCR减少功率消耗,延长便携设备电池续航;
  3. 小型化可靠性:0201封装适配高密度布局,厚膜工艺保障参数稳定,适合量产与长期使用;
  4. 宽场景适配:600mA额定电流满足多数便携设备需求,2.4nH电感值适配高频阻抗匹配常见场景。

该产品凭借村田的工艺优势与高频性能,成为射频、高速数字领域小型化设备的优选电感元件。

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