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muRata GRM033R71E222KA12D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM033R71E222KA12D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM033R71E222KA12D
- Electronic Component
- 1
- Electronic Component
- 2.2nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257274302
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM033R71E222KA12D 产品概述
一、产品简介
GRM033R71E222KA12D 为村田（muRata）生产的多层陶瓷贴片电容（MLCC），额定电容值为 2.2nF，公差 ±10%（K），额定电压 25V，介质为 X7R。该型号采用 0201（公制 1005）超小封装，适合对体积和布局密度要求极高的移动设备与微型电子产品。
二、主要规格与性能
- 容值：2.2nF（2200pF），公差 ±10%
- 额定电压：25V DC
- 介质：X7R（温度范围 -55°C 至 +125°C，电容随温度变化受限于 X7R 特性）
- 稳定性：X7R 在宽温区间保持良好介电性能，适用于旁路、去耦与耦合等常见用途。
三、封装与机械特性
0201 超小封装利于高密度 PCB 布局与减小器件高度，但对贴装精度与回流工艺要求较高。该器件具有良好的机械强度，但也需注意在焊接与修理时避免侧向应力或过度弯曲。
四、典型应用场景
适用于移动终端、无线通信模块、微型传感器模块、消费电子、医疗便携设备等对体积、重量和去耦性能有严格要求的电路中。常用作电源去耦、信号耦合与高频滤波元件。
五、可靠性与环境特性
村田产品按行业标准制造，具备良好振动与温度循环性能。X7R 介质在高湿高温等环境下性能稳定，但在极端应力下电容值可能发生可逆或不可逆变化，需按应用场景评估寿命与退化。
六、焊接与使用建议
建议采用符合厂商推荐的回流焊温度曲线与合适的焊膏量，避免过度机械应力和反复加热。存储与贴装过程中做好防潮与防静电保护，贴片时控制贴装压力，避免器件破裂。
七、选型要点
选型应综合考虑容值公差、工作电压、温度稳定性、尺寸限制与电路工作频率。0201 封装适合空间受限设计，但需确保生产能力与良率。若需更高温度稳定性或更小温漂，可考虑 C0G/NP0 类无介质电容替代；若要求更高电压或更大容量，则选择更大封装或不同型号。
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