WMSIC Electronic Components

muRata LQG15HS10NG02D

ModelLQG15HS10NG02D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQG15HS10NG02D
Type
MURATA
Unit
Electronic Component
Minimum package
10000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQG15HS10NG02D
Electronic Component
1
Package
0402
Electronic Component
SMD Inductor
Electronic Component
±2%
Electronic Component
0.015g
Inductor
10nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0230286250
Current
500mA
Frequency
3.4GHz
Resistor(DCR)
260mΩ
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQG15HS10NG02D 产品概述

一、产品简介

LQG15HS10NG02D 是村田(muRata)推出的一款贴片高频电感,封装尺寸为 0402,标称电感值 10 nH,精度 ±2%,额定直流电流 500 mA,直流电阻(DCR)为 260 mΩ,品质因数 Q=8(测量频率 100 MHz),自谐振频率(SRF)3.4 GHz。该器件以尺寸小、精度高和良好的高频特性为特点,适合空间受限的高频电路与滤波、匹配等用途。

二、主要电气参数(要点)

  • 电感值:10 nH(±2%)
  • 额定电流:500 mA
  • 直流电阻(DCR):260 mΩ
  • 品质因数:Q = 8 @ 100 MHz
  • 自谐振频率:SRF = 3.4 GHz
  • 封装:0402(村田 LQG15HS 系列)

三、性能解读与设计意义

  • 精度 ±2%:对需要精确电感值的匹配网络、谐振电路和滤波器非常有利,减小频率漂移和调试工作量。
  • Q 值为 8 @100MHz:属中等偏低的 Q,说明在 100 MHz 附近有一定损耗。适合需要宽带或有损耗抑制的阻抗匹配与 EMI 抑制场合,但对于要求极高 Q 的窄带谐振电路需谨慎评估。
  • SRF = 3.4 GHz:在该频率以上电感不再表现为感性元件,应避免在接近或超过 SRF 的频段作为感性元件使用;在 GHz 级应用中可利用其电感-电容并联/串联特性进行设计。
  • DCR = 260 mΩ 与额定电流 500 mA:器件会产生 I·R 电压降及 I^2R 损耗(例如在满载 0.5 A 下,功耗约 0.065 W,压降约 0.13 V),需在电源链路或滤波器设计中考虑热量与压降影响。

四、典型应用

  • 射频匹配网络、输入/输出阻抗匹配
  • 高频滤波器、阻抗折衷网络(L、T、π 型滤波)
  • EMI 抑制、共模/差模滤波(与电容配合)
  • 天线馈线阻抗调谐与偏置线路阻隔
  • 移动通信模组、Wi‑Fi、蓝牙、电视及其他 RF 前端

五、PCB 布局与安装建议

  • 采用与 0402 相匹配的焊盘,保持焊盘间距和过孔布局符合厂商推荐(若有 Datasheet,请参考其建议焊盘)。
  • 最小化引线到关键节点的走线长度,减少寄生电感与电容影响高频性能。
  • 为降低热阻和改善散热,若电流接近额定值,应在器件周围使用较大的铜箔或热焊盘扩展。
  • 焊接工艺应遵循无铅回流规范,避免过长的再流高温或机械应力导致元件裂纹。安装时避免横向剪切力与过度弯曲。

六、功率与热管理注意事项

  • 以例子说明:在 500 mA 工作电流下,功耗 P = I^2·R = 0.5^2 × 0.26 ≈ 0.065 W;电压降约 0.5 × 0.26 = 0.13 V。长时间高温工作会提升金属电阻并可能影响电感值与寿命。
  • 在高温或高电流环境下建议做电流裕量和温升评估,必要时选用更大封装或低 DCR 器件。

七、可靠性与测试建议

  • 进行温度循环和焊接应力测试,确认在实际工艺下电感值和 DCR 的稳定性。
  • 在 RF 设计中应做 S 参数测量以评估在目标频段的实际阻抗、插入损耗与回波损耗(S11/S21)。
  • 考虑标签、包装的防潮处理与储存条件(IMO)。

八、选型与采购建议

  • 若电路对 Q 值或更低 DCR 有更高要求,可比较同类 0402 规格下其他型号或更大封装(如 0603/0805)产品。
  • 精度 ±2% 适合精密匹配场景;对宽带或高功率传输,可评估额定电流余量。
  • 采购时关注原厂货源与批次一致性,必要时索取样品与完整 Datasheet 进行系统级验证。

总结:LQG15HS10NG02D 是一款适合高频小型化电路的 10 nH 精密贴片电感,优势在于小体积和高精度,但在高电流与高 Q 需求的场合需权衡 DCR 和热管理。对于射频匹配与 EMI 抑制类应用,它是一个常用且实用的选择。

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