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muRata GRM0335C1H4R7BA01D
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1H4R7BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H4R7BA01D
- Electronic Component
- 1
- Electronic Component
- 4.7pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0264721641
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H4R7BA01D 产品概述
一、产品基本信息
GRM0335C1H4R7BA01D 为村田（muRata）生产的贴片多层陶瓷电容（MLCC），标称容量 4.7 pF，额定电压 50 V，温度系数为 C0G（NP0），封装规格为 0201（公称尺寸 0.6 × 0.3 mm 级别），适用于对容量稳定性与低损耗有较高要求的小型电路设计。
二、主要特性
- C0G（NP0）温度特性，温度范围内容量变化极小，线性度好。
- 极低的介质损耗（低 ESR、低 DF），适合高频信号路径。
- 0201 超小封装，节省 PCB 面积，便于高密度布板。
- 良好的机械与焊接性能，适配常规回流焊工艺。
三、典型应用
- 高频滤波、匹配网络与天线前端电路；
- 振荡器、定时与参考电路中对容量精度要求高的场合；
- ADC/DAC 前端、模拟信号路径及射频电路；
- 空间或便携设备中对小尺寸和高可靠性的需求。
四、封装与 PCB 使用建议
- 0201 尺寸对贴装精度和锡膏印刷要求较高，推荐使用精细锡膏模板与高精度贴片机；
- 设计焊盘时参考厂商推荐的 land pattern，控制焊盘尺寸与过孔距离以避免应力集中；
- 回流焊温度曲线遵循村田焊接指南，避免超温或长时间高温以降低微裂纹风险；
- 装配后避免在电容两端施加过大的机械应力或弯曲。
五、可靠性与使用建议
- C0G 型电容具有极小的温度与时间漂移，基本不存在容量老化问题；
- 额定电压 50 V，应根据实际电压环境和安全裕度选择适当额定值；在高湿或高冲击环境下应注意封装与固定；
- 储存与焊接前防潮处理按厂商建议执行，避免长时间暴露造成污染或焊接缺陷。
六、采购与替代
村田为主流供应商，常见于批量采购与现货。若需替代件，可选择 TDK、KEMET、Yageo 等厂商相同参数（4.7 pF、50 V、C0G、0201）的 MLCC，采购时比对温度特性、容差和封装尺寸以确保互换性。
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