Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GJM0335C1E1R0BB01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GJM0335C1E1R0BB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM0335C1E1R0BB01D
- Electronic Component
- 1
- Electronic Component
- 1pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0254043646
- Electronic Component
- C0G
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM0335C1E1R0BB01D 产品概述
一、产品简介
GJM0335C1E1R0BB01D 是村田（muRata）推出的一款超小型贴片多层陶瓷电容（MLCC），基本参数为：容值 1 pF，额定电压 25 V，介质类型 C0G（又称 NP0），封装为 0201。该系列以体积小、温度稳定性好、介质损耗低著称，适用于对容值稳定性和频率特性要求较高的电路。
二、主要特性
- C0G（NP0）介质：温度系数近于 0 ppm/°C，温漂极小，直流偏压下容值变化和介质损耗（tanδ）均非常小。
- 小容值高频优势：1 pF 属于小容值范围，适合高频、射频电路中精确的频率分布与匹配。
- 0201 极小封装：便于高密度贴片布局，适合体积受限的移动设备和射频前端模块。
- 可靠性与一致性：作为村田品牌产品，工艺成熟、品质可控，提供卷带包装便于表面贴装(SMT)。
三、典型应用场景
- 射频（RF）匹配网络、谐振回路与阻抗调整。
- 高频滤波器、耦合与去耦（在高频段）。
- 振荡器和定时电路中的微小容值元件。
- 精密仪表、传感器接口中需要温漂小的参考电容。
四、选型与电路布局注意事项
- 寄生参数影响显著：1 pF 量级的电容，其有效容值容易被引线、电路板走线和焊盘的寄生电容掩盖，布局需尽量缩短走线并采用合适的地平面。
- 容值公差与测量：小容值测量对仪器和测试夹具要求高，选择公差时应考虑工艺波动和测试精度。
- 焊膏用量与贴装：0201 尺寸对焊膏量、锡膏印刷和回流曲线敏感，应优化锡膏量以避免偏位或 tombstone。
- 电压系数：C0G 介质电压系数很小，但在极端偏压下仍需关注实际电压对容值的微弱影响。
五、贴装、存储与可靠性建议
- 回流焊兼容：按照通用无铅/有铅回流曲线进行工艺设置，避免过长高温暴露以减少热应力。
- 搬运与贴装：0201 元件容易受机械应力影响，推荐使用真空吸笔或适配吸嘴，避免弯曲或侧向冲击。
- 防潮保存：长时间存储请使用干燥包装（密封卷带、干燥剂），在锡膏印刷前遵循回潮烘干要求。
- 清洁与测试：若需清洗，应采用对陶瓷材料安全的溶剂，避免超声处理导致应力或裂纹。
六、采购与替代方案
- 采购注意：确认所需容值公差、包装卷轴长度和拉带方向，向供应商索取规格书与可靠性测试报告。
- 替代厂商：在需要多源保障时，可考虑 TDK、AVX、KEMET 等厂商的同类 C0G 0201 1 pF 产品，注意比对尺寸、温漂和电压额定。
使用提示：在射频与高精度应用中，优先保证布局与焊接工艺的稳定性，实际设计中可与 PCB 仿真和网络分析相结合，验证寄生效应后的等效容值与频率响应。
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