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muRata GRM1555C1H6R8BA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GRM1555C1H6R8BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM1555C1H6R8BA01D
- Electronic Component
- 1
- Electronic Component
- 6.8pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0257274024
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述 — GRM1555C1H6R8BA01D（村田）
一、产品简介
GRM1555C1H6R8BA01D 为村田（muRata）生产的一款多层陶瓷片式电容（MLCC），封装为 0402（约 1.0 × 0.5 mm），标称电容 6.8 pF，额定电压 50 V，温度系数为 C0G（等同于 NP0），公差 ±0.1 pF。该器件以高稳定性、低损耗和优良的温度/频率特性著称，适合对电容精度和温漂要求较高的电路。
二、主要电气与物理特性
- 电容：6.8 pF；公差 ±0.1 pF（约 ±1.5%）
- 额定电压：50 V DC
- 温度系数：C0G/NP0（接近 0 ppm/°C，温漂极小）
- 封装：0402（SMD，适合高速贴片生产）
- 材料与性能：多层陶瓷介质，损耗因子低、Q 值高，自谐频率高，直流偏压效应小
三、典型应用场景
- 高频射频匹配网络、耦合/旁路元件
- 振荡器与谐振电路（压控振荡、晶体负载）
- 精密滤波与定时电路，对温度和时间稳定性要求高的传感与测量系统
- ADC、参考电路的旁路与去耦（小容值用于抑制高频噪声）
四、选型与注意事项
- 精度要求：±0.1 pF 为较紧公差，适用于对容值稳定性有较高要求的设计；如环境或制造偏差可能导致需求放宽或选用更大封装。
- 直流偏压与容量衰减：C0G/NP0 型介质最小化了电压系数，但小尺寸下仍可能存在一定 DC-bias，需在实际工作电压下验证。
- 封装与可靠性：0402 封装体积小，易受机械应力影响；在有高板弯或振动处需考虑应力缓释或选用更大封装。
五、焊接与制造建议
- 推荐采用标准回流焊工艺（遵循厂商回流曲线），避免超温或多次重复加热。
- PCB 焊盘设计应保证良好焊接 fillet，避免过大焊膏造成立碑或应力集中，焊盘与阻焊开口配合可提高贴片可靠性。
- 贴装与存储遵循厂家包装（卷带）与潮湿敏感性处理建议，若长时间暴露于潮湿环境，按要求回烤处理后贴装。
六、测试与质量控制
- 建议在 1 MHz（或设计所依赖频段）进行容量与损耗测试，测量电压采用小信号电压以避免偏置影响。
- 对关键批次可做温度循环、振动和焊接热冲击试验以验证稳健性。
小结：GRM1555C1H6R8BA01D 以其优异的温度稳定性和精密公差，适合高频与精密模拟场景。设计时兼顾直流偏压、机械应力与焊接工艺，可以获得长期稳定可靠的性能表现。若需进一步电气模型或完整数据手册，可参考村田官方规格书以获得更详细的参数与回流曲线。
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