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muRata GRM0335C1H181JA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM0335C1H181JA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H181JA01D
- Electronic Component
- 1
- Electronic Component
- 180pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257359377
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H181JA01D 产品概述
一、基本信息
GRM0335C1H181JA01D 为村田（muRata）生产的贴片多层陶瓷电容（MLCC），主要参数如下：
- 标称容量：180 pF
- 精度：±5%（J）
- 额定电压：50 V DC
- 温度特性：C0G（又称 NP0，近似零温漂）
- 封装：0201（超小型贴片）
- 系列：GRM（高可靠性通用型）
二、主要特性
- 极佳的温度稳定性：C0G 温度係数接近零，适合对电容值稳定性要求高的电路。
- 频率响应好、损耗小：适合高频和射频应用，具有高 Q 值与低介质损耗。
- 电容随偏压变化小：相比高介质常数陶瓷（X7R、X5R 等），C0G 在直流偏压下容量衰减可忽略。
- 超小封装（0201）：占板面积极小，利于高密度 PCB 设计，但对贴装与焊接工艺要求较高。
三、典型应用场景
- 高频滤波、阻抗匹配与射频电路中的耦合/旁路。
- 振荡器、定时与谐振网络（需高稳定性电容值的模拟电路）。
- 精密模拟前端、ADC 输入网络等对温漂与线性度敏感的场合。
- 空间受限的消费电子、通信模块与射频前端。
四、装配与使用建议
- PCB 设计：尽量缩短走线，使用对称焊盘，减小应力集中，避免靠 PCB 边缘和过孔附近。
- 回流焊工艺：遵循制造商的回流曲线与湿度防护要求，必要时回流前进行烘烤以防吸湿导致焊接裂纹。
- 机械应力：0201 尺寸对机械应力敏感，板弯曲或强烈冲击可能导致芯片裂纹，装配和测试时应注意夹具和夹持力。
- 电压裕量：虽然 C0G 电容对偏压不敏感，但仍建议按设计要求保留足够的电压裕量并避免长期过压。
五、检验与测量要点
- 建议在标准条件下（例如 1 MHz、25°C）测量电容和损耗角正切（DF）。
- 对于高频应用，应评估电感（ESL）与等效串联电阻（ESR）在目标频段的表现。
- 进行热循环与机械应力测试以验证在实际工况下的可靠性。
六、选型建议小结
若项目需要在极小占板面积内实现高稳定性、低损耗的中低容值电容（如滤波、谐振、时基电路），GRM0335C1H181JA01D 是优秀选择。若需要更大容值或用于大电流旁路场合，应考虑封装更大或介质不同的产品系列。
总体而言，本型号凭借 C0G 的温度与电压稳定性、村田的制造质量及 0201 封装的高密度优势，适用于要求精度与高频性能的现代电子设计。
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