WMSIC Electronic Components

muRata GRM155R71H223KA12D

ModelGRM155R71H223KA12D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155R71H223KA12D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155R71H223KA12D
Electronic Component
1
Electronic Component
22nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0126222059
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM155R71H223KA12D

引言:
在当今电子设备日益miniature化的趋势下,表面贴装电容器(MLCC)因其体积小、可靠性高,以及良好的电气性能而成为不可或缺的关键元器件之一。GRM155R71H223KA12D是一款由知名电子元器件制造商村田(muRata)生产的高性能多层陶瓷电容器(MLCC),专为满足现代电子设计需求而设计。以下将详细介绍其技术参数、特性与应用场景。

基本参数:

  • 电容量:22nF(0.022µF)
  • 容差:±10%
  • 额定电压:50V
  • 温度系数:X7R
  • 工作温度范围:-55°C ~ 125°C
  • 安装类型:表面贴装(MLCC)
  • 封装尺寸:0402(1005 公制)
    • 长度:1.00mm
    • 宽度:0.50mm
    • 最大厚度:0.55mm

详细分析:

  1. 性能特点:

    • 高电压与高稳定性:GRM155R71H223KA12D的额定电压为50V,使其适用于多种高电压应用场景。其X7R温度系数确保在宽温度范围内(-55°C至125°C)可靠工作,具备出色的温度稳定性和电容量保持能力。
    • 小尺寸与轻重量:0402封装尺寸(1.00mm x 0.50mm),使其非常适合空间受限的应用,有助于终端产品的轻量化和便携化。
    • 良好的频率特性:MLCC电容器通常具备良好的高频性能,适合在高频信号滤波和去耦应用中使用。
  2. 应用领域: GRM155R71H223KA12D广泛应用于各种电子设备中,包括:

    • 消费电子:如手机、平板电脑、笔记本电脑等,需要高密度封装的电子元器件。
    • 工业设备:可以在恶劣环境中稳定工作,适合用于工业控制器和传感器等设备。
    • 汽车电子:随着汽车电子化进程的加快,具有宽工作温度范围的MLCC也逐渐被应用于各种汽车电子系统,包括整车控制、导航和信息娱乐系统等。
    • 通信设备:在基站、路由器等通讯设备中,GRM155R71H223KA12D具有改善信号完整性和降低干扰的潜力。
  3. 安装与兼容性:

    • 表面贴装技术(SMT)使得GRM155R71H223KA12D能够与现代自动化生产线兼容,方便批量生产。
    • 焊接方式:兼容多种焊接工艺,适应不同的生产需求。
  4. 质量与可靠性: 村田作为全球领先的电子元器件制造商,GRM155R71H223KA12D具有高标准的质量控制,确保每个产品都符合工业应用的可靠性要求。该电容器在长期高温、高电压的工作条件下,依然能够保持良好的性能表现。

结论:
GRM155R71H223KA12D以其出色的电气性能、稳定的温度特性和小巧的封装尺寸,成为了现代电子设计中不可或缺的选择。无论是在消费电子、工业设备还是汽车电子领域,其广泛的适应性和高可靠性,使其在多个应用中具备良好的市场竞争力。随着技术的不断进步与创新,GRM155R71H223KA12D预计将在未来的电子产品中继续发挥重要作用。

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