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muRata LQP03HQ2N3B02D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata LQP03HQ2N3B02D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03HQ2N3B02D
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.008g
- Inductor
- 2.3nH
- Electronic Component
- 1
- Factor
- 20@500MHz
- Electronic Component
- BM0259012915
- Current
- 600mA
- Frequency
- 9GHz
- Resistor(DCR)
- 120mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQP03HQ2N3B02D 产品概述
一、产品简介
LQP03HQ2N3B02D 为 muRata（村田）系列贴片厚膜电感，封装规格为 0201（约 0.6 × 0.3 mm 级），额定电感值 2.3 nH。该器件直流电阻（DCR）典型为 120 mΩ，额定电流 600 mA，自谐振频率（SRF）高达 9 GHz，在 500 MHz 时品质因数 Q ≈ 20，适用于高频、小型化电路设计。
二、主要性能与特点
- 高频特性优良：高 SRF（9 GHz）与较高的 Q 值，适合射频前端、滤波与匹配网络。
- 小型化封装：0201 体积极小，有利于空间受限的移动设备与微型模块。
- 低 DCR 与中等载流：120 mΩ 的直流电阻兼顾损耗与热耗，600 mA 的额定电流满足一般射频和去耦需求。
- 可靠性：厚膜工艺稳定，适合标准回流焊工艺装配。
三、典型应用场景
- 手机、平板等移动终端的射频匹配与滤波电路。
- 无线通信模块（Wi‑Fi、蓝牙、LTE/5G 前端）中的阻抗调节或谐振网络。
- 高频去耦、抑制电磁干扰的局部电感元件。
- 微型化高频系统和模块化 PCB 设计。
四、封装与焊接建议
- 推荐使用与 0201 对应的焊盘尺寸，并在 PCB 设计中考虑最小过孔与焊盘间距以降低焊接应力。
- 支持无铅回流焊工艺，建议按厂商回流曲线进行温度控制，避免长时间高温造成焊接失效或电感性能退化。
- 装配时采用防静电与防机械冲击的搬运方式，0201 封装易受外力影响。
五、选型与使用注意事项
- 若电路工作频率接近元件 SRF，应评估电感实际等效电路并进行仿真或测量，避免寄生电容导致性能偏离。
- 在高电流或高温环境下，请注意自热与实测 DCR 增加对电路的影响；必要时选用更高额定电流或更低 DCR 的型号。
- 在关键射频链路中，建议结合网络分析仪测量 S 参数以确认匹配效果。
如需更详细的封装图、回流焊曲线或等效电路参数，可参考 muRata 官方规格书或联系供应商获取完整资料。
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