WMSIC Electronic Components

muRata GRM033R60J224ME15D

ModelGRM033R60J224ME15D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM033R60J224ME15D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM033R60J224ME15D
Electronic Component
1
Electronic Component
220nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0229970672
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM033R60J224ME15D

概要

GRM033R60J224ME15D 是由村田制作所(muRata)生产的一款高性能多层陶瓷电容(MLCC),适用于各种电子设备中的通用应用。以下是该产品的详细介绍。

基础参数

  • 电容值:0.22 µF(220 nF)
  • 容差:±20%
  • 额定电压:6.3 V
  • 温度系数:X5R
  • 工作温度范围:-55°C ~ 85°C

应用场景

GRM033R60J224ME15D 适用于广泛的电子设备和系统,包括但不限于:

  • 消费电子产品(如智能手机、平板电脑、电视等)
  • 汽车电子系统
  • 工业控制设备
  • 医疗设备
  • 通信设备

其通用性使其成为许多设计工程师的首选。

封装和尺寸

  • 封装类型:0201(0603 公制)
  • 大小/尺寸:0.024" 长 x 0.012" 宽(0.60mm x 0.30mm)
  • 厚度(最大值):0.013"(0.33mm)

这种小型化的设计使得 GRM033R60J224ME15D 非常适合现代电子产品中的空间有限的应用场景。

特性

温度稳定性

GRM033R60J224ME15D 采用 X5R 温度系数,这意味着在 -55°C 到 85°C 的温度范围内,电容值的变化不会超过 ±15%。这种优秀的温度稳定性确保了该电容在各种环境条件下都能保持稳定的性能。

容差

该电容具有 ±20% 的容差,这是一种常见且合理的容差范围,适合大多数通用应用。这种容差范围可以满足大多数设计要求,同时也考虑到了成本和生产效率。

额定电压

额定电压为 6.3 V,这对于许多低至中等电压的应用来说是足够的。它提供了足够的安全余量,以防止因过压而导致的故障。

安装类型

GRM033R60J224ME15D 采用表面贴装(SMT)技术,这是现代电子制造中的主流方法。这种安装方式不仅提高了生产效率,还减少了手工操作的错误率,并且可以实现更高密度的布局。

品牌和质量保证

作为村田制作所(muRata)的一款产品,GRM033R60J224ME15D 具有高质量和可靠性的保证。村田制作所是全球领先的电子元器件制造商,其产品广泛应用于各个行业,并以其卓越的性能和可靠性而闻名。

使用建议

  1. 设计考虑: 在设计时,应确保 PCB 布局能够满足 0201 封装的尺寸要求,并考虑到焊接过程中的热应力。

  2. 焊接过程: 由于这是一个小型化的表面贴装组件,需要使用适当的焊接技术和设备,以确保良好的接触和可靠性。

  3. 环境条件: 在实际应用中,应确保工作环境温度不会超过 -55°C ~ 85°C 的范围,以避免因超出温度范围而导致的性能下降或故障。

总结

GRM033R60J224ME15D 是一款高性能、通用性强、尺寸小巧的多层陶瓷电容,非常适合现代电子设备中的各种应用场景。其优异的温度稳定性、合理的容差范围和高可靠性,使其成为设计工程师的理想选择。通过选择这一产品,您可以确保您的电子设备具有稳定可靠的性能,并满足严格的质量标准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.