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muRata GJM1555C1H2R2BB01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GJM1555C1H2R2BB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1H2R2BB01D
- Electronic Component
- 1
- Electronic Component
- 2.2pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0229970674
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1H2R2BB01D 产品概述
一、型号与主要参数
GJM1555C1H2R2BB01D 为村田（muRata）出品的多层陶瓷贴片电容（MLCC），封装尺寸为 0402（公制 1005）。额定电压 50V，标称电容值 2.2pF，温度系数为 C0G（又称 NP0），属于极稳定型陶瓷介质，适合对温漂和频率特性有严格要求的电路。
二、材料与结构特点
该系列采用高稳定性 C0G 陶瓷介质，具有极低的温度系数与极小的老化效应。0402 的超小封装使得器件体积非常有限，同时多层结构保证了足够的电容量和可靠的焊接强度。表面电极和端接工艺适配自动贴片与回流焊流程。
三、电气性能与优势
C0G 材料在 -55°C 至 +125°C 温度范围内近似零温漂（典型 ±30 ppm/°C 级别），介电损耗低，自谐频率高，直流偏压效应极小，频率响应稳定。2.2pF 的小电容值非常适合射频匹配、谐振回路与高频旁路场景，等效串联电感（ESL）与等效串联电阻（ESR）均较低，利于高 Q 值与低损耗设计。
四、典型应用场景
- 射频前端的匹配与谐振元件（滤波、阻抗匹配、天线调谐）
- 高频振荡器、时钟电路中的负载/谐振电容
- 精密模拟与测量电路中对温漂敏感的耦合或分压元件
- 高频采样、滤波与去耦（当电容值与频率带宽匹配时）
五、装配与设计建议
- 推荐采用标准回流焊工艺，遵循村田提供的温度曲线，避免超温或长时间回流；
- PCB 设计应尽量缩短与接地的回流路径，减小寄生电感；
- 对于长期可靠性考虑，可在设计中留有一定电压裕度（实践中可考虑 ≤80% 额定电压）；
- 避免在安装或使用时施加过大的弯曲或机械应力，以防裂纹造成失效。
六、可靠性与质量要点
C0G 材料具有极低的介质吸收与老化特性，长期稳定性优良。村田产品通常通过高级封装与严苛的出厂测试，批次间一致性好。常规注意事项包括防潮存储（遵循出厂包装与开盘后再流焊时间限制）与避免机械应力。
七、选型参考与替代
在需要更大电容量或更高介电常数时，可考虑 X7R / X5R 系列；但若应用对温度稳定性和频率特性有硬性要求，C0G（NP0）仍为首选。选型时注意封装、工作频率与电压裕度匹配。
总结：GJM1555C1H2R2BB01D 以其 2.2pF、50V 和 C0G 材质的组合，在射频、振荡和精密模拟领域表现优异，适合对温漂、频率稳定性和低损耗有严格要求的设计。
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