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muRata GRM158C80G226ME01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM158C80G226ME01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM158C80G226ME01D
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Electronic Component
- BM0227789140
- Electronic Component
- X6S
- Voltage
- 4V
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM158C80G226ME01D 产品概述
一、产品简介
GRM158C80G226ME01D 为 muRata（村田）出品的贴片多层陶瓷电容（MLCC），封装 0402，额定容量 22 μF，容量公差 ±20%，额定电压 4 V，温度特性 X6S。该型号采用高介电常数材料实现小体积下的大容量，适合要求体积受限且需较大去耦/储能的消费类与便携电子产品。
二、主要参数
- 品牌/型号：muRata GRM158C80G226ME01D
- 封装：0402（适合高密度贴装）
- 容值：22 μF ±20%
- 额定电压：4 V DC
- 温度特性：X6S（宽温性能，适用于较高工作温度场合）
- 元件类型：多层陶瓷电容（MLCC）
三、关键性能与工程注意事项
- 电压偏置效应：高介电 MLCC 在直流偏置下容量会明显下降，尤其在接近或高于额定电压时，实际工作容量可能低于标称值。设计时建议查看厂商的容量随偏压曲线，并考虑去耦网络或升压额定电压以补偿。
- 温度特性：X6S 提供较宽的工作温度范围并兼顾容量密度，但温度变化仍会导致容量漂移，需与系统温度曲线匹配。
- ESR/ESL：MLCC 本身具有很低的等效串联电阻与感抗，适合高频去耦与瞬态电流需求，但在需要大能量缓冲时，仍建议搭配低频电解/钽电容形成混合去耦方案。
- 机械脆性：0402 小封装易受焊接热与机械应力影响，注意 PCB 阵列、焊膏量及回流曲线以降低裂纹风险。
四、典型应用场景
- SoC/CPU、PMIC 的电源去耦与局部储能
- 手机、TWS、可穿戴设备等体积受限的消费电子
- IoT 芯片组和高速数字电路的旁路去耦
- 需要高频性能的滤波电路
五、选型建议与替代方案
- 若 DC 偏置后有效容量不足，考虑提高额定电压（如 6.3V）或选择更稳定的温度特性（X5R/X7R）或更大封装（0603/0805）以获得更稳定的实测容量。
- 对于要求更大储能或低频平滑，可与铝电解/固态电容并联使用以覆盖宽频段性能。
六、装配与可靠性建议
- 推荐采用厂家推荐的回流焊工艺参数与 PCB 焊盘尺寸，避免冷却过快或焊膏过厚引发裂纹。
- 生产过程中需注意机械应力控制（尤其板曲和元件挤压），并在关键应用中进行热循环、振动与电气性能验证。
七、结论
GRM158C80G226ME01D 以其在 0402 封装中实现的较高电容值，适合高密度产品中的去耦与瞬态储能应用。但设计时必须考虑 DC 偏置与温度对容量的影响、以及小封装下的装配可靠性问题。建议在最终设计前参考村田数据手册的电气特性曲线并完成样机验证。
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