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muRata GRM0335C1H9R0BA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1H9R0BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H9R0BA01D
- Electronic Component
- 1
- Electronic Component
- 9pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257359376
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H9R0BA01D 产品概述
GRM0335C1H9R0BA01D 是村田（muRata）一款贴片多层陶瓷电容（MLCC），标称容量 9 pF，额定电压 50 V，介质为 C0G（也称 NP0），封装为 0201（微小型贴片）。该系列以尺寸小、温度特性优良和损耗低著称，适合对稳定性、线性度和高频性能有较高要求的电路设计。
一、主要特性
- 容值：9 pF，适用于小容量耦合、谐振与匹配电路。
- 额定电压：50 V，满足多数信号链和中低电压电路的耐压要求。
- 温度系数：C0G（近似零温漂，典型温度系数接近 0 ppm/°C，工业上常以 ±30 ppm/°C 为参考），在宽温度范围内保持容量稳定。
- 损耗低、等效串联电阻（ESR）小和自谐频率高，适合高频应用。
- 超小封装 0201，有利于产品小型化和高密度布板。
二、典型应用场景
- 射频（RF）匹配、谐振回路与滤波器（高 Q 值对频率稳定性要求高的场合）。
- 高频耦合与去耦、电路定时和相位调整（振荡器、时钟电路）。
- 精密模拟电路中对温漂和线性度敏感的元件网络。
- 移动终端、无线模块、射频前端、传感器接口及高密度 PCB 设计。
三、布局与使用建议
- 布局时尽量缩短电容与相连器件之间的走线，减小串联电感与寄生影响。
- 高频路径应采用短而粗的走线，并在需要时使用地平面或地过孔降低回路阻抗。
- 对于射频匹配元件，建议在调试阶段预留替换空间以便微调电容值。
- 0201 封装尺寸小，贴装时需保证锡膏量和焊接工艺稳定，避免过多机械应力导致裂纹。
四、焊接与可靠性注意事项
- 兼容常规回流焊工艺，建议遵循器件厂家回流温度曲线以减少热应力。
- 小尺寸陶瓷电容对机械应力和弯曲敏感，波峰焊或手工焊接时应注意加热和冷却速率。
- 存储与搬运应防潮、防尘并注意防静电。贴片过程中避免产生碰撞和压迫，减少裂纹和微裂。
五、采购与封装信息
- 品牌：muRata（村田）；型号：GRM0335C1H9R0BA01D。
- 封装：0201，适合超小型化产品和高密度 PCB 布局。
- 选型时可关注温度系数（C0G）、额定电压与频率特性，并结合电路工作频段选择相应型号。
总结：GRM0335C1H9R0BA01D 以其 9 pF 小容量、50 V 耐压和 C0G 近零温漂特性，成为射频、精密模拟及高密度便携设备中常用的微型高稳定性电容选项。在使用时重视布局、焊接工艺与机械保护，可发挥其在高频与温度稳定性方面的优势。
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